5SGXEB6R1F43C2LG

The 5SGXEB6R1F43C2LG is a Stratix® V GX field programmable gate array (FPGA) in a 1760‑FBGA (1760‑FCBGA) package. It implements a high logic element count and substantial on‑chip RAM for complex, programmable digital designs.

Designed for commercial applications, the device offers a large I/O footprint and a defined operating voltage and temperature range to support demanding FPGA-based systems requiring high integration and on‑board memory resources.

Key Features

• Core Architecture — Stratix V GX family Device belongs to the Stratix V GX series, providing the architecture and device-level characteristics described for Stratix V GX devices in the datasheet.
• Logic Capacity Approximately 597,000 logic elements to implement large-scale digital logic, custom accelerators, and complex state machines.
• Embedded Memory Approximately 53.25 Mbits of embedded memory (total RAM bits: 53,248,000) for on‑chip buffering, FIFOs, and scratchpad storage.
• I/O Density Up to 600 user I/Os to support wide parallel interfaces, multiple high-speed lanes, and rich board connectivity.
• Package and Mounting 1760‑FCBGA package (42.5 × 42.5 mm) with surface‑mount mounting for high‑density PCB integration.
• Power and Voltage Core supply range specified at 820 mV to 880 mV to match system power-rail planning and regulator selection.
• Operating Temperature Specified operating range from −40 °C to 100 °C for deployment across a broad set of commercial environments.
• Regulatory RoHS compliant, supporting lead‑free manufacturing and environmental compliance requirements.

Typical Applications

• High‑density digital processing — Large logic capacity and abundant on‑chip RAM enable complex FPGA implementations such as custom signal processing pipelines and hardware accelerators.
• Data plane and packet processing — High I/O count and Stratix V GX family transceiver capabilities (as described for the series) support networking and data‑path functions.
• Telecommunications and high‑speed interfaces — The Stratix V GX family documentation lists transceiver speed grades suitable for high‑speed serial links used in comms equipment and test systems.

Unique Advantages

• High logic density: 597,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Substantial embedded memory: Approximately 53.25 Mbits of on‑chip RAM reduce reliance on external memory for buffering and state storage.
• Extensive I/O resources: 600 I/Os provide flexibility for parallel interfaces, multi‑lane connectivity, and rich peripheral integration.
• Robust packaging for dense designs: 1760‑FCBGA (42.5 × 42.5 mm) supports high pin‑count requirements while remaining suitable for surface‑mount assembly.
• Defined power envelope: Core voltage range of 820–880 mV simplifies power rail design and regulator selection for consistent device operation.
• Commercial temperature capability: Specified operation from −40 °C to 100 °C allows deployment across a wide set of commercial environments.

Why Choose 5SGXEB6R1F43C2LG?

The 5SGXEB6R1F43C2LG combines large logic capacity, extensive embedded memory, and a high I/O count in a single 1760‑FCBGA package. It is positioned for commercial designs that require high integration density and significant on‑chip resources while adhering to defined power and thermal parameters.

Engineers designing advanced communications, data‑processing, or high‑density digital systems can leverage the device’s Stratix V GX family characteristics, on‑chip RAM, and I/O resources to consolidate board-level functionality and simplify system architecture.

Request a quote or submit an inquiry for 5SGXEB6R1F43C2LG to get pricing and availability information for your next design.