5SGXEB6R1F43C1N

The 5SGXEB6R1F43C1N is a high-density Stratix V GX Field Programmable Gate Array (FPGA) in a 1760-ball FCBGA package. It combines hundreds of thousands of logic elements with tens of megabits of embedded memory and a large I/O count for complex, integration-heavy designs.

Targeted at commercial-grade applications, this device delivers a combination of programmable logic capacity, on-chip memory, and extensive I/O while operating within a 0 °C to 85 °C temperature window and an 870 mV to 930 mV core supply range.

Key Features

• Logic Capacity  Approximately 597,000 logic elements, providing the programmable fabric needed for dense digital designs and large-scale logic integration.
• Embedded Memory  Approximately 53.248 Mbits of on-chip RAM to support buffering, data processing, and state storage without relying solely on external memory.
• I/O Density  600 user I/O pins to support high-channel-count interfaces and multi-board system connectivity.
• Package & Mounting  1760-ball FCBGA (1760-FCBGA, 42.5 × 42.5 mm) in a surface-mount package suitable for compact system-level integration.
• Power  Core supply operating range of 870 mV to 930 mV for compatibility with modern FPGA power architectures.
• Commercial Grade  Rated for commercial operating temperatures from 0 °C to 85 °C.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Use the large logic element count and substantial on-chip RAM for complex signal processing, protocol stacks, or packet-processing pipelines.
• Multi-interface system controllers  Leverage 600 I/O pins to aggregate and interface with numerous peripherals, sensors, or board-to-board links in a single FPGA.
• Data buffering and on-chip memory tasks  Embedded memory capacity supports frame buffering, lookup tables, and intermediate data storage within the FPGA fabric.

Unique Advantages

• High logic integration: With roughly 597,000 logic elements, the device lets you consolidate multiple functions into a single programmable device, reducing BOM count and board complexity.
• Substantial on-chip memory: Approximately 53.248 Mbits of embedded RAM reduce dependency on external memory for many buffering and storage tasks, improving system latency and simplifying memory routing.
• Extensive I/O support: 600 I/O pins provide flexibility to connect numerous peripherals or high-channel-count interfaces without immediately resorting to external multiplexing.
• Compact, manufacturable package: The 1760-FCBGA surface-mount package (42.5 × 42.5 mm) enables high-density board layouts while supporting standard surface-mount assembly processes.
• Commercial operating range: Specified 0 °C to 85 °C operation aligns with a broad set of commercial applications and environments.
• RoHS compliant: Meets standard environmental regulations for lead-free manufacturing.

Why Choose 5SGXEB6R1F43C1N?

The 5SGXEB6R1F43C1N positions itself as a high-capacity Stratix V GX FPGA for commercial designs that require a large logic fabric, substantial embedded memory, and a high I/O count in a compact FCBGA package. Its specified core voltage range and commercial temperature rating make it suitable for system-level integration where performance, integration density, and manufacturability are key considerations.

This device is well suited to engineering teams building complex digital subsystems that benefit from on-chip RAM and extensive I/O, offering a balance of programmable resources and package-level integration backed by Stratix V family documentation.

If you would like pricing, availability, or to request a formal quote for part number 5SGXEB6R1F43C1N, please submit a quote request or product inquiry through your usual procurement channel.