5SGXEB6R1F40I2N

The 5SGXEB6R1F40I2N is a Stratix® V GX-series Field Programmable Gate Array (FPGA) in a 1517‑FBGA (40×40) surface-mount package. It delivers a high-density programmable fabric with a large embedded memory complement and a substantial I/O count for complex digital designs.

Designed for industrial-temperature deployment, this device offers approximately 597,000 logic elements, approximately 53 Mbits of embedded RAM, and 432 I/Os. As part of the Stratix V GX family, the device aligns with the series-level transceiver and timing capabilities described in the Stratix V device datasheet.

Key Features

• Core Logic Density  Approximately 597,000 logic elements to implement complex digital functions, custom datapaths, and large-scale state machines.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM for buffering, lookup tables, and data storage close to the fabric.
• I/O Capacity  432 I/O pins to support wide parallel interfaces, multiple peripherals, or numerous serial lanes.
• Power Supply  Core voltage supply range: 870 mV to 930 mV, compatible with low-voltage power domains.
• Package & Mounting  1517‑FBGA (40×40) package; surface-mount mounting for board-level SMD assembly.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in extended-temperature environments.
• Series Transceiver Capabilities  As a Stratix V GX-family device, the series includes transceiver speed grades described in the Stratix V datasheet (for example, GX channel speed grades up to 14.1 Gbps).
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High‑speed communications  Leverage the Stratix V GX family transceiver capabilities for multi‑gigabit serial interfaces and high‑bandwidth link implementations.
• Industrial control and automation  Industrial-grade temperature range and robust I/O count make the device suitable for demanding control and instrumentation systems.
• Compute‑intensive processing  High logic density and substantial on‑chip RAM support custom accelerators, signal processing, and complex state machines.
• Prototyping and system integration  Large fabric and memory resources enable system architects to consolidate functions and validate high‑complexity designs on a single device.

Unique Advantages

• High integration density: The combination of ~597,000 logic elements and ~53 Mbits of embedded RAM reduces the need for external logic and memory components.
• Extensive I/O: 432 I/Os provide flexibility for wide buses, numerous peripherals, and multiple serial lanes without immediate external multiplexing.
• Industrial robustness: Rated for −40 °C to 100 °C operation and supplied in a rugged FBGA package for board‑level reliability in extended‑temperature environments.
• Low‑voltage core support: Core supply range of 870–930 mV allows integration with modern low‑voltage power architectures.
• Family transceiver options: As part of the Stratix V GX family, designers can access the series’ documented transceiver speed grades for high‑bandwidth serial connectivity.
• RoHS compliant: Conforms to RoHS requirements for environmentally conscious designs.

Why Choose 5SGXEB6R1F40I2N?

The 5SGXEB6R1F40I2N combines high logic and memory density with a large I/O complement and industrial-grade temperature support, making it well suited for complex digital systems that require on‑device integration and reliability. Its 1517‑FBGA surface-mount package and low core voltage range allow designers to integrate this FPGA into compact, modern power architectures.

Engineers and system designers targeting high‑density programmable implementations, multi‑gigabit serial links (via the Stratix V GX family transceiver options), and extended‑temperature operation will find this device aligned with demanding embedded and industrial requirements while maintaining compliance with RoHS standards.

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