5SGXEB6R1F40C2N

The 5SGXEB6R1F40C2N is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel. It provides very high logic density and embedded memory in a compact 1517-FBGA (40×40) surface-mount package for commercial-temperature designs.

With 597,000 logic elements, approximately 53 Mbits of on-chip RAM, and 432 I/O pins, this device is suited for complex digital systems that require large programmable logic capacity, substantial on-chip memory, and extensive external connectivity while operating within a commercial temperature range.

Key Features

• Logic Capacity — 597,000 logic elements to support large-scale, highly parallel digital designs.
• Embedded Memory — Approximately 53 Mbits of total RAM bits (53,248,000) for buffering, data storage, and on-chip packet or frame processing.
• I/O Density — 432 general-purpose I/O pins to enable broad external device and interface support.
• Package & Mounting — 1517-FBGA (40×40) package in a surface-mount form factor for high-density board integration.
• Supply Voltage — Core operating supply range of 870 mV to 930 mV for regulated core-power design.
• Commercial Temperature Grade — Rated for 0°C to 85°C operation and specified as commercial grade.
• Standards Compliance — RoHS compliant for lead-free, environmentally conscious designs.

Typical Applications

• High-density digital systems — Implement large-scale custom logic, compute pipelines, and protocol engines using extensive logic elements and embedded memory.
• Memory-intensive processing — Use on-chip RAM for buffering, FIFOs, and temporary data storage in streaming or packet-processing applications.
• Interface aggregation and bridging — Leverage 432 I/Os for complex peripheral connectivity, multi-channel interfaces, and protocol bridging tasks.
• Commercial equipment and enterprise systems — Deploy in equipment designed for 0°C to 85°C operating environments where high density and connectivity are required.

Unique Advantages

• High logic integration: 597,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial on-chip RAM: Approximately 53 Mbits of embedded memory minimizes external memory dependence and lowers BOM for memory-heavy applications.
• Extensive I/O resources: 432 I/Os provide flexibility to interface with numerous peripherals, sensors, and high-density connectors without external expanders.
• Compact, manufacturable package: 1517-FBGA (40×40) surface-mount packaging supports dense PCB layouts and automated assembly processes.
• Commercial temperature suitability: Rated 0°C to 85°C to match a wide range of enterprise and commercial deployments.
• RoHS compliant: Meets environmental lead-free requirements for modern product development and compliance needs.

Why Choose 5SGXEB6R1F40C2N?

The 5SGXEB6R1F40C2N delivers a blend of very high logic density, significant on-chip memory, and broad I/O count in a practical 1517-FBGA surface-mount package for commercial-grade applications. Its core supply range and thermal rating make it suitable for engineered systems that require predictable performance within standard commercial operating conditions.

This part is ideal for design teams building sophisticated digital systems that need to consolidate functions on a single FPGA, reduce external component count, and maintain flexibility for future firmware-defined updates. The combination of capacity, memory, and I/O supports scalable designs with clear upgrade paths within the Stratix V GX family.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the 5SGXEB6R1F40C2N. Our team can help you evaluate this Stratix V GX device for your commercial design requirements.