5SGXEB6R1F40C2LN

The 5SGXEB6R1F40C2LN is a Stratix V GX field‑programmable gate array (FPGA) from Intel, delivered in a 1517‑FBGA (40×40) surface‑mount package and specified for commercial temperature operation. The device combines a large programmable‑logic fabric with substantial on‑chip memory and extensive I/O to support complex digital designs.

Engineered for applications that require high logic capacity and dense I/O, this Stratix V GX device provides a balance of logic density, embedded memory, and transceiver‑oriented architecture as described in the Stratix V device documentation.

Key Features

• High Logic Capacity — 597,000 logic elements to accommodate large FPGA designs and complex datapath implementations.
• Embedded Memory — Approximately 53.25 Mbits of on‑chip RAM for buffering, on‑chip storage, and embedded data structures.
• Extensive I/O — 432 user I/Os to support wide external interfacing and dense board‑level connectivity.
• Package and Mounting — 1517‑FBGA (40×40) supplier device package supplied as a surface‑mount component for compact assembly.
• Core Voltage Range — Core voltage supply range of 820 mV to 880 mV, supporting designer control of core power rails.
• Commercial Grade Range — Specified operating temperature of 0 °C to 85 °C and listed as Commercial grade.
• Standards Compliance — RoHS‑compliant manufacturing status for environmental regulatory alignment.

Typical Applications

• High‑speed serial connectivity — Leverage the Stratix V GX transceiver‑oriented architecture (see device documentation) alongside the device’s large logic and memory resources to implement multi‑gigabit link logic and protocol processing.
• Network and communications processing — Use the abundant logic elements and on‑chip RAM for packet processing, buffering, and custom protocol acceleration.
• High‑density I/O systems — The 432 I/Os enable interfacing to a wide set of peripherals and parallel data busses for data‑capture and aggregation applications.

Unique Advantages

• Large programmable fabric: 597,000 logic elements provide headroom for complex algorithms, custom accelerators, and extensive control logic.
• Significant on‑chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory for many buffering and state‑storage needs.
• High I/O count: 432 I/Os simplify board routing for multi‑lane interfaces and parallel data paths, reducing external interface complexity.
• Compact, production‑ready package: The 1517‑FBGA (40×40) surface‑mount package balances pin density and board area for production designs.
• Controlled core power range: A defined 820 mV–880 mV supply window supports predictable core power provisioning and thermal planning.
• Regulatory alignment: RoHS compliance supports environmentally conscious manufacturing and procurement.

Why Choose 5SGXEB6R1F40C2LN?

The 5SGXEB6R1F40C2LN positions itself as a high‑capacity Stratix V GX FPGA option where large logic resources, substantial embedded RAM, and extensive I/O are required. Its commercial temperature rating and defined core voltage range make it suitable for production systems that demand predictable electrical and thermal characteristics.

Designers who need a dense programmable fabric with on‑chip memory and multi‑lane I/O capability will find this part aligned with medium‑to‑large FPGA designs. The device benefits from the Stratix V family documentation for electrical, switching and transceiver characteristics, supporting design validation and system integration.

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