5SGXEB6R1F40C2LG

The 5SGXEB6R1F40C2LG is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers high logic density and substantial embedded memory in a compact 1517‑FBGA (40×40) surface‑mount package for commercial‑grade applications.

Designed for designs that require large numbers of logic elements, extensive on‑chip RAM and a high I/O count, this device supports core supply voltages from 820 mV to 880 mV and operates across a commercial temperature range of 0 °C to 85 °C. It is RoHS compliant.

Key Features

• Core Logic  Approximately 597,000 logic elements for implementing complex programmable logic and large FPGA designs.
• On‑Chip Memory  Approximately 53.25 Mbits of embedded RAM (53,248,000 bits) to support data buffering, FIFOs and on‑chip storage.
• High I/O Count  432 user I/O pins to support broad peripheral and interface connectivity directly from the device.
• Stratix V GX Family  Part of the Stratix V GX family; device-level electrical and switching characteristics are defined in the Stratix V device datasheet.
• Power  Core supply voltage range of 820 mV to 880 mV for core power planning and supply design.
• Package & Mounting  1517‑FBGA (40×40) surface‑mount package for dense board integration.
• Operating Conditions & Grade  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High‑density logic implementations  Use the large logic element count to implement resource‑heavy digital systems and custom accelerators.
• On‑chip memory intensive functions  Embedded RAM supports buffering, packet queues and intermediate data storage within FPGA logic.
• Multi‑interface systems  A high I/O count enables integration with a variety of peripherals and external devices directly from the FPGA.

Unique Advantages

• High logic density: Approximately 597,000 logic elements provide the capacity to implement large, complex designs without partitioning across multiple devices.
• Substantial embedded memory: Approximately 53.25 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and temporary storage needs.
• Extensive I/O: 432 I/O pins enable flexible system interfacing and support for multiple parallel connections.
• Compact, serviceable package: 1517‑FBGA (40×40) surface‑mount packaging balances board density with thermal and routing considerations.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to meet a broad range of commercial embedded applications.
• Regulatory compliance: RoHS compliance simplifies product environmental planning and approvals.

Why Choose 5SGXEB6R1F40C2LG?

The 5SGXEB6R1F40C2LG combines large programmable logic capacity, significant embedded RAM and a high I/O count in a single Stratix V GX FPGA package. Its core voltage range and commercial temperature rating make it suitable for demanding commercial designs that require on‑chip resources and integration density.

This device is appropriate for engineering teams building complex digital systems that need substantial on‑chip resources and flexible I/O in a compact surface‑mount package, and for projects where RoHS compliance and defined commercial operating conditions are required.

Request a quote or submit a purchasing inquiry to evaluate 5SGXEB6R1F40C2LG for your next FPGA design.