5SGXEB6R1F40I2G

The 5SGXEB6R1F40I2G is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, delivered in a 1517‑FBGA (40×40) surface-mount package. It provides a high-density programmable logic fabric with substantial embedded memory and broad I/O capability for complex, logic- and memory-intensive designs.

Specifically targeted for industrial-grade applications, this device operates from 870 mV to 930 mV and across an operating temperature range of −40 °C to 100 °C, making it suitable for deployments that require extended temperature tolerance and robust on-board resources.

Key Features

• Core Architecture  Stratix® V GX FPGA family implementation providing a high-density programmable logic fabric.
• Logic Capacity  597,000 logic elements to implement large-scale digital designs and custom hardware acceleration.
• Configurable Logic Blocks  225,400 LABs/CLBs (logic array blocks) for flexible partitioning of logic and routing resources.
• Embedded Memory  Approximately 53.248 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive algorithms.
• I/O Resources  432 user I/O pins to support extensive peripheral, bus, and multi-channel interfacing.
• Power  Core supply range of 870 mV to 930 mV for the device core power domain.
• Package & Mounting  1517‑FBGA (40×40) package in a surface-mount format for compact board-level integration.
• Industrial Temperature Grade  Rated for −40 °C to 100 °C operation for reliability in extended-temperature environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Complex algorithms and custom datapaths that leverage the device’s 597,000 logic elements and on-chip RAM.
• Memory-intensive functions  Designs requiring substantial embedded memory for buffering, packet processing, or streaming data handling.
• Multi-channel I/O systems  Applications that need broad connectivity and parallel interfacing enabled by 432 I/O pins.
• Industrial control and automation  Systems that benefit from industrial-grade temperature operation (−40 °C to 100 °C) and surface-mount packaging.

Unique Advantages

• High logic density: 597,000 logic elements support large, integrated designs and reduce the need for multiple devices.
• Substantial on-chip memory: Approximately 53.248 Mbits of embedded RAM enables efficient local data storage and lower external memory dependence.
• Extensive I/O availability: 432 user I/Os allow flexible interfacing to peripherals, sensors, and multi-lane systems without sacrificing routing options.
• Industrial temperature capability: Rated for −40 °C to 100 °C to meet extended-environment deployment requirements.
• Compact BGA package: 1517‑FBGA (40×40) provides a space-efficient solution for high-density PCBs and surface-mount assembly.
• Regulatory readiness: RoHS compliance for use in designs requiring restricted-substances conformity.

Why Choose 5SGXEB6R1F40I2G?

The 5SGXEB6R1F40I2G combines a high count of logic elements, plentiful embedded memory, and broad I/O capacity in a compact 1517‑FBGA package, delivering a practical platform for complex, memory- and I/O-intensive designs. Its industrial temperature rating and RoHS compliance make it suitable for demanding environments where extended temperature tolerance and regulatory compliance matter.

This FPGA is well suited to engineering teams developing large-scale programmable logic implementations that require integrated memory, abundant I/O, and a robust package for surface-mount assembly. The device aligns with designs that prioritize integration, scalability, and predictable electrical specifications.

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