5SGXEB6R1F43C2L

The 5SGXEB6R1F43C2L is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1760-FCBGA package (42.5 × 42.5 mm). It provides a combination of large logic capacity, substantial embedded memory, and high I/O density for complex digital designs.

Targeted for commercial-grade systems, this device is specified for a core supply range of 820 mV to 880 mV and an operating temperature range of 0 °C to 85 °C. As a Stratix V GX family device, the series-level datasheet documents GX transceiver channel capabilities and commercial/industrial speed grades.

Key Features

• Logic Capacity — 597,000 logic elements to support large, resource-intensive designs and multi-function implementations.
• Embedded Memory — Approximately 53.2 Mbits of on-chip RAM for buffering, FIFO, and on-chip storage needs.
• I/O Density — 600 user I/O pins, enabling broad external connectivity without external I/O expanders.
• Package and Mounting — 1760-FCBGA (42.5 × 42.5 mm) surface-mount package for space-efficient board integration.
• Power and Operating Range — Core voltage supply 820 mV to 880 mV; commercial operating temperature rating from 0 °C to 85 °C.
• Series Transceiver Capability (series-level) — Stratix V GX family documentation references GX channel transceiver speeds up to 14.1 Gbps (series specification).
• Regulatory — RoHS compliant.

Typical Applications

• High-density digital processing — Leverage the large logic element count and embedded memory for complex signal processing, protocol bridging, and algorithm acceleration.
• Multi-I/O systems — Use the 600 I/Os to connect numerous peripherals, sensors, and external interfaces directly to the FPGA fabric.
• Board-level integration — The 1760-FCBGA package and surface-mount mounting make the device suitable for compact board designs that require significant programmable logic resources.

Unique Advantages

• Large on-chip resources: 597,000 logic elements and approximately 53.2 Mbits of RAM reduce dependence on external logic and memory, simplifying BOM and PCB routing.
• High I/O count: 600 I/Os enable flexible system partitioning and extensive peripheral connectivity without additional interface chips.
• Compact, manufacturable package: 1760-FCBGA (42.5 × 42.5 mm) surface-mount package supports dense PCB layouts while maintaining thermal and electrical performance expected for commercial deployments.
• Commercial-grade qualification: Rated for 0 °C to 85 °C operation, suitable for commercial applications and standard operating environments.
• Series-level transceiver options: As part of the Stratix V GX family, the device aligns with series specifications for GX transceiver channel speeds referenced in the datasheet.
• Regulatory compliance: RoHS conformity supports global electronic manufacturing requirements.

Why Choose 5SGXEB6R1F43C2L?

The 5SGXEB6R1F43C2L balances very large logic capacity and substantial on-chip RAM with a high I/O count and a manufacturing-friendly FCBGA package, making it a strong choice for designers building complex commercial systems that require dense programmable logic and abundant local memory. Its specified core voltage range and commercial temperature rating provide clear electrical and environmental boundaries for system integration.

Engineers and procurement teams seeking a Stratix V GX-series FPGA from Intel will find this device suitable for designs that demand integration of large digital functions, extensive interfacing, and adherence to RoHS requirements, with series-level transceiver capabilities documented in the Stratix V device datasheet.

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