5SGXEB6R1F43C2N

The 5SGXEB6R1F43C2N is a Stratix V GX Field Programmable Gate Array (FPGA) designed for high-density, programmable logic applications. It integrates a large array of logic resources, substantial on-chip memory, and extensive I/O capacity to address complex system designs within commercial temperature ranges.

With 597,000 logic elements, approximately 53.25 Mbits of embedded memory, and up to 600 I/Os, this device is well suited to designs that require high logic density, wide interfacing, and a compact surface-mount package.

Key Features

• Core Logic: 597,000 logic elements provide significant programmable fabric density for complex logic implementations and system integration.
• Embedded Memory: Approximately 53.25 Mbits of on-chip RAM for buffering, lookup tables, and state storage to support large data paths and control structures.
• I/O Connectivity: 600 I/O pins to support broad peripheral interfacing, parallel buses, and multiple high-pin-count subsystems.
• Package & Mounting: 1760-BBGA (1760-FCBGA) surface-mount package with a supplier package dimension of 42.5 × 42.5 mm for high-density board layouts.
• Power Supply: Core supply range of 0.870 V to 0.930 V, enabling integration into designs with low-voltage core rails.
• Temperature Grade: Commercial device rated for 0 °C to 85 °C operation suitable for standard commercial electronics applications.
• Compliance: RoHS compliant, meeting common environmental requirements for modern electronic systems.

Typical Applications

• High-density digital processing: Use the large logic array and embedded memory for compute-intensive algorithms, custom accelerators, and real-time data-path processing.
• Interface aggregation and protocol bridging: Leverage 600 I/Os to consolidate multiple buses and interfaces or implement multi-protocol gateways on a single device.
• System integration for commercial equipment: Integrate control, signal processing, and glue-logic into a compact surface-mount solution for communication, instrumentation, and test equipment.

Unique Advantages

• High logic density: 597,000 logic elements reduce the need for multiple devices and simplify board-level integration.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM supports large buffers and state machines without external memory dependencies.
• Large I/O count: 600 I/Os enable direct connection to many peripherals and high-pin-count subsystems, reducing external multiplexing.
• Compact, industry-standard package: 1760-FCBGA (42.5 × 42.5 mm) provides a high-pin-count, surface-mount form factor for dense PCB designs.
• Commercial temperature rating: 0 °C to 85 °C matches general-purpose electronic product requirements for commercial deployments.
• Environmental compliance: RoHS compliance supports regulatory and manufacturing requirements for lead-free assembly.

Why Choose 5SGXEB6R1F43C2N?

The 5SGXEB6R1F43C2N delivers a combination of high logic capacity, substantial embedded memory, and extensive I/O in a compact surface-mount FCBGA package tailored for commercial applications. Its electrical and package characteristics make it suitable for designers who need to consolidate complex functions onto a single FPGA while maintaining a small PCB footprint.

As a member of the Stratix V family, this device is specified with clear operating conditions and electrical characteristics, making it a practical choice for commercial systems that require scalable logic resources and robust on-chip memory without exceeding commercial temperature limits.

Request a quote or submit an inquiry to our sales team to discuss availability, lead times, and volume pricing for the 5SGXEB6R1F43C2N.