5SGXEB6R1F43C2LN

The 5SGXEB6R1F43C2LN is a Stratix® V GX family FPGA IC from Intel, delivering high on-chip logic capacity and substantial embedded memory in a high-pin-count FCBGA package. It is intended for commercial-temperature systems that require dense logic arrays, large on-chip RAM, and extensive I/O connectivity.

With approximately 597,000 logic elements, roughly 53.25 Mbits of embedded memory, and up to 600 I/O pins, this device targets designs that integrate complex digital logic, large buffers or scratch memory, and numerous board-level interfaces while operating from a core supply in the 820 mV–880 mV range.

Key Features

• Core Logic Capacity  Approximately 597,000 logic elements to support large, integrated digital designs and complex system functions.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive algorithms without relying on external memory for many tasks.
• High I/O Count  Up to 600 I/O pins to support dense board-level interfacing and multi-channel connectivity.
• Package  1760-ball FCBGA (1760-FCBGA, 42.5 × 42.5 mm) surface-mount package for compact board integration with a high pin density.
• Power Supply  Core voltage supply range of 820 mV to 880 mV to match platform power-rail requirements.
• Operating Grade and Temperature  Commercial grade specified for operation from 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High‑density logic integration  Use the large logic element count to consolidate multiple functions into a single device and simplify board-level design.
• Memory‑intensive buffering  Embedded RAM capacity supports on-chip buffering, packet queues, and intermediate data storage for streaming or packetized data flows.
• High‑pin-count interface systems  The 600 I/O pins enable multiple parallel interfaces, sensor arrays, or multi-channel data acquisition front ends.
• Complex system prototyping  Provides on-chip resources suitable for prototyping integrated systems that require significant logic and memory in a single FPGA.

Unique Advantages

• High logic density: Approximately 597,000 logic elements reduce the need for multiple FPGAs in large designs, simplifying BOM and board layout.
• Substantial on‑chip memory: Approximately 53.25 Mbits of embedded RAM enables larger data buffers and reduces dependency on external memory for many use cases.
• Extensive I/O availability: 600 I/O pins provide flexibility for complex interfacing and parallel channel implementations.
• Space-efficient FCBGA packaging: 1760-FCBGA (42.5 × 42.5 mm) delivers high pin count in a compact footprint for dense board designs.
• Commercial temperature rating: Qualified for 0 °C to 85 °C operation, matching many commercial and enterprise system requirements.
• RoHS compliant: Meets common environmental compliance requirements for electronics manufacturing.

Why Choose 5SGXEB6R1F43C2LN?

The 5SGXEB6R1F43C2LN positions itself as a high-capacity Stratix V GX FPGA option for designers who need significant on-chip logic and memory combined with a large number of I/Os in a single device. Its commercial temperature grade, tight core voltage window, and FCBGA packaging make it suitable for dense, performance-oriented board designs where integration and reduced external components are priorities.

Choose this device for projects that require consolidated digital functions, substantial embedded buffering, and flexible interface options while maintaining a compact board footprint and RoHS compliance.

Request a quote or submit an inquiry to obtain pricing and availability for 5SGXEB6R1F43C2LN and to discuss how this Stratix V GX FPGA can fit your next design.