5SGXEB6R1F43I2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 597000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,079 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 225400 | Number of Logic Elements/Cells | 597000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXEB6R1F43I2G – Stratix® V GX FPGA, 1760‑FCBGA, Industrial
The 5SGXEB6R1F43I2G is a Stratix® V GX field programmable gate array (FPGA) IC delivering very high logic density and extensive I/O for demanding industrial and commercial systems. This surface-mount device combines a large programmable fabric with substantial on-chip RAM and a high I/O count in a 1760‑FCBGA package.
With 597,000 logic elements, approximately 53.25 Mbits of embedded memory, and 600 I/O pins, the device is suited to applications that require large-scale programmable logic, significant local storage, and broad external connectivity. It is specified for industrial temperature operation (‑40 °C to 100 °C) and a core supply range of 870 mV to 930 mV.
Key Features
- Core Logic 597,000 logic elements provide a high-density programmable fabric for complex logic and parallel processing tasks.
- Embedded Memory Approximately 53.25 Mbits of on-chip RAM to store data, buffers, and state close to the logic fabric.
- High Pin Count I/O 600 I/O pins support extensive external interfacing for multi-channel systems and dense board-level connectivity.
- Power and Voltage Core supply specified between 870 mV and 930 mV, enabling controlled operation within defined voltage margins.
- Package and Mounting 1760‑FCBGA (1760‑BBGA) surface-mount package, supplier package 1760‑FCBGA with 42.5 × 42.5 mm dimensions, for compact, high-pin-count PCB designs.
- Temperature and Grade Industrial-grade qualification with an operating temperature range from ‑40 °C to 100 °C for deployment in industrial environments.
- Environmental Compliance RoHS compliant to support regulatory and manufacturing requirements.
Typical Applications
- High-performance Networking and Communications Large logic capacity and abundant I/O make the device suitable for packet processing, protocol bridging, and dense interface aggregation.
- Signal Processing and Acceleration High logic density and on-chip RAM support FPGA-based DSP workloads, algorithm acceleration, and custom compute pipelines.
- Industrial Control and Automation Industrial temperature rating and broad I/O enable deployment in motor control, factory automation, and real-time control systems.
- Test & Measurement and Data Acquisition Large local memory and many I/O channels suit high-channel-count acquisition, preprocessing, and buffering in instrumentation systems.
Unique Advantages
- High integration density: 597,000 logic elements reduce the need for multiple devices by consolidating complex functions into a single FPGA.
- Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM minimizes external memory dependencies and improves latency for data-intensive tasks.
- Extensive external connectivity: 600 I/O pins provide flexibility for multi-protocol interfaces and dense board-level connections.
- Industrial-grade robustness: Rated for ‑40 °C to 100 °C operation to meet the requirements of harsh or temperature-variable environments.
- Compact, high-pin-count package: 1760‑FCBGA (42.5 × 42.5 mm) delivers high I/O in a single, manufacturable surface-mount package.
- Regulatory readiness: RoHS compliance supports environmentally regulated manufacturing processes.
Why Choose 5SGXEB6R1F43I2G?
The 5SGXEB6R1F43I2G combines a large programmable fabric, significant embedded memory, and a high I/O count in a compact 1760‑FCBGA surface-mount package, making it a strong choice for designs that demand density, flexibility, and rugged operation. Its industrial temperature rating and controlled core voltage range enable reliable deployment in industrial and commercial systems.
This part is suited for engineering teams building high-channel-count, compute-intensive, or latency-sensitive systems that benefit from on-chip memory and broad external interfacing. The device’s specification set supports scalable FPGA designs where integration and long-term availability are key considerations.
Request a quote or submit a technical inquiry to obtain pricing, lead-time, and availability information for 5SGXEB6R1F43I2G. Refer to the manufacturer’s datasheet for detailed electrical and switching characteristics.

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