5SGXEB6R2F40C2N

The 5SGXEB6R2F40C2N is a Stratix® V GX field programmable gate array (FPGA) IC delivered in a 1517‑FBGA (40×40) surface-mount package. It combines a large logic fabric, substantial on‑chip memory, and a broad I/O complement for demanding, high‑capacity designs.

Designed for commercial temperature operation, this Stratix V GX device is suitable for applications that require high logic density, abundant embedded memory, and multi‑grade transceiver options as described in the Stratix V device documentation.

Key Features

• Logic Capacity — 597,000 logic elements to implement large-scale, complex digital designs.
• Embedded Memory — Approximately 53.25 Mbits of on‑chip RAM for buffering, lookup tables, and data processing.
• I/O Density — 432 general-purpose I/O pins to support wide parallel interfaces and board-level connectivity.
• Transceiver Options (series-level) — Stratix V GX devices are offered with transceiver speed grades; refer to the Stratix V device documentation for available GX transceiver grades and channel rates.
• Core Supply — Narrow core voltage range: 870 mV to 930 mV for consistent power domain requirements.
• Package & Mounting — 1517‑FBGA (40×40) surface-mount package optimized for high-density board layouts.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation.
• RoHS Compliant — Meets RoHS environmental requirements for lead‑free assembly.

Typical Applications

• High‑speed serial communications — Use the Stratix V GX transceiver grade options for multi‑gigabit serial links and interface bridging.
• Large‑scale logic integration — Implement complex state machines, protocol stacks, and custom compute pipelines using the device’s 597,000 logic elements.
• Memory‑intensive processing — Leverage approximately 53.25 Mbits of embedded RAM for buffering, packet processing, and streaming data algorithms.
• I/O‑dense systems — Integrate broad parallel and serial interfaces across 432 I/O pins for board‑level and mezzanine connectivity.

Unique Advantages

• High logic density: 597,000 logic elements provide the headroom required for complex, multi‑function FPGA designs.
• Significant on‑chip RAM: Approximately 53.25 Mbits of embedded memory reduces external memory dependence and lowers BOM complexity.
• Robust I/O count: 432 I/Os enable flexible interfacing to peripherals, high‑speed buses, and parallel data paths.
• Compact, serviceable package: 1517‑FBGA (40×40) surface‑mount packaging supports dense PCB layouts while maintaining manufacturability.
• Defined commercial operating range: 0 °C to 85 °C rating aligns with a wide set of commercial applications and deployment environments.
• Regulatory readiness: RoHS compliance supports modern assembly and environmental requirements.

Why Choose 5SGXEB6R2F40C2N?

The 5SGXEB6R2F40C2N positions itself as a high‑capacity Stratix V GX FPGA suitable for projects that demand extensive logic resources, substantial embedded RAM, and a large I/O footprint in a compact 1517‑FBGA package. Its specified core voltage range and commercial temperature rating make it appropriate for engineered, board‑level solutions that require predictable electrical and thermal behavior.

This device is well matched to design teams building high‑density digital systems that need scalability and the performance characteristics documented for the Stratix V family. The combination of logic capacity, on‑chip memory, and series‑level transceiver options provides a platform that supports complex custom acceleration, protocol handling, and high‑throughput data paths with long‑term availability backed by the Stratix V device documentation.

Request a quote or submit an inquiry to receive pricing, availability, and additional procurement information for the 5SGXEB6R2F40C2N.