5SGXEB6R2F40I2G

The 5SGXEB6R2F40I2G is an industrial-grade Stratix® V GX FPGA IC in a 1517‑FBGA (40×40) surface-mount package. It integrates very high logic density and embedded memory with a large I/O complement for complex, board‑level digital designs.

Key silicon characteristics include 597,000 logic elements, approximately 53.25 Mbits of embedded memory, and 432 user I/Os. The device operates from a core supply range of 870 mV to 930 mV and is specified for operation from –40 °C to 100 °C.

Key Features

• High-density logic: 597,000 logic elements to implement large custom logic, datapaths, and control subsystems on a single device.
• Substantial embedded memory: Approximately 53.25 Mbits of on‑chip RAM for large buffers, FIFOs, and on‑chip data storage.
• Rich I/O complement: 432 user I/Os supporting complex board-level interfacing and multi‑lane connectivity.
• Industrial temperature grade: Rated for –40 °C to 100 °C operating temperature to meet harsher environmental requirements.
• Compact package: 1517‑FBGA (40×40) surface‑mount package for high‑density board designs.
• Low-voltage core operation: Core supply specified from 870 mV to 930 mV for integration into low-voltage power domains.
• Standards and compliance: RoHS compliant.
• Family-level transceiver options: Stratix V GX devices are offered with transceiver speed grades described in the Stratix V device datasheet.

Typical Applications

• High-density digital systems: Implement complex state machines, large combinational logic, and parallel datapaths using the device's large logic element count and on‑chip memory.
• Board-level protocol aggregation: Use the 432 I/Os to consolidate and interface multiple high-speed and parallel peripheral channels on a single FPGA.
• Industrial controls and instrumentation: Exploit the industrial temperature grade and high integration to support embedded control, signal processing, and interface bridging in industrial equipment.

Unique Advantages

• Large integrated capacity: 597,000 logic elements combined with ~53.25 Mbits of embedded RAM reduces the need for external logic and memory devices.
• High I/O availability: 432 user I/Os simplify board routing and allow direct connection to many peripherals without additional multiplexing logic.
• Industrial robustness: Specified for –40 °C to 100 °C operation to support deployments in challenging temperature environments.
• Space-efficient packaging: 1517‑FBGA (40×40) surface‑mount package enables high-density board designs while maintaining a compact footprint.
• Low-voltage core: 870–930 mV core supply range supports low-voltage system architectures and power-optimized designs.
• Regulatory compliance: RoHS compliant for environmental and manufacturing considerations.

Why Choose 5SGXEB6R2F40I2G?

The 5SGXEB6R2F40I2G positions itself for designs that require a combination of very high logic capacity, substantial on‑chip memory, and extensive I/O in an industrial-rated FPGA. Its core voltage range and FBGA packaging make it practical for compact, power-conscious boards while preserving the integration needed to reduce external components.

This device is well suited to engineering teams building advanced digital systems that require scalability, high integration, and robust environmental performance, backed by the Stratix V family device documentation and support resources.

Request a quote or submit an inquiry for pricing and availability of the 5SGXEB6R2F40I2G to begin integrating this Stratix V GX FPGA into your design.