5SGXEB6R2F40I2LG

The 5SGXEB6R2F40I2LG is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 1517‑FBGA (40×40) package and specified for industrial operation. It delivers high-density programmable logic, a large on‑chip memory resource, and a substantial I/O count for complex digital designs.

Key value comes from its combination of 597,000 logic elements, approximately 53.25 Mbits of embedded memory, and 432 user I/Os, making it suited to applications that require dense logic, significant embedded RAM, and broad external connectivity while operating across an industrial temperature range.

Key Features

• Core / Logic Capacity 597,000 logic elements provide a high-density programmable fabric for complex, multi‑function designs.
• Embedded Memory Approximately 53.25 Mbits of on‑chip RAM enable large buffers, FIFOs, and memory‑intensive algorithms without external memory for many use cases.
• I/O and System Integration 432 user I/Os support extensive external interfacing and system connectivity requirements.
• Package & Mounting 1517‑FBGA (40×40) package, surface‑mount mounting type for compact PCB integration.
• Power Supply Core voltage supply range specified from 820 mV to 880 mV for the device core.
• Operating Range & Grade Industrial grade device rated for operation from −40°C to 100°C and compliant with RoHS requirements.
• Series‑level Transceiver Support (refer to datasheet) Stratix V GX family devices are offered with transceiver speed grades at the series level (examples shown in the series datasheet include GX channel speeds such as 14.1 Gbps and 12.5 Gbps); consult the device datasheet for specific part speed‑grade availability.

Typical Applications

• High‑performance networking — The combination of high logic count and large embedded memory supports packet processing, switching, and protocol offload functions requiring dense logic and buffering.
• Signal processing & acceleration — Significant embedded RAM and available logic resources enable implementation of DSP pipelines, FPGA‑based accelerators, and real‑time processing chains.
• Industrial control & automation — Industrial temperature rating and broad I/O count make the device suitable for complex control systems and machine automation where reliability and connectivity matter.

Unique Advantages

• High integration density: 597,000 logic elements reduce the need for multiple devices by consolidating complex functions into a single FPGA.
• Large on‑chip memory: Approximately 53.25 Mbits of embedded RAM supports in‑FPGA buffering and reduces dependence on external memory for many designs.
• Extensive I/O capability: 432 user I/Os allow flexible interfacing with peripherals, sensors, and multi‑lane external links.
• Industrial temperature performance: Specified −40°C to 100°C operation supports deployment in harsh or temperature‑variable environments.
• Compact, board‑level package: 1517‑FBGA (40×40) surface‑mount package simplifies PCB layout for space‑constrained designs.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXEB6R2F40I2LG?

The 5SGXEB6R2F40I2LG delivers a high‑density Stratix V GX FPGA solution that balances logic capacity, embedded memory, and extensive I/O in a compact FBGA package. Its industrial temperature rating and RoHS compliance make it suitable for demanding production environments where uptime and regulatory adherence are priorities.

This part is appropriate for engineering teams building systems that require substantial programmable logic and on‑chip memory—such as networking equipment, signal processing accelerators, and industrial controllers—while leveraging Intel’s Stratix V GX device family and associated documentation for device‑level design guidance.

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