5SGXEB6R2F40I2L

The 5SGXEB6R2F40I2L is a Stratix® V GX field programmable gate array from Intel, supplied in a 1517-FBGA (40×40) package and qualified to industrial temperature grades. This device provides substantial on-chip resources — including approximately 597,000 logic elements and roughly 53 Mbits of embedded memory — along with 432 user I/Os, making it suitable for complex digital systems that require high logic density, sizable embedded RAM, and large I/O connectivity.

Key Features

• Core Logic Approximately 597,000 logic elements for large-scale programmable logic integration and complex design implementation.
• Embedded Memory Approximately 53 Mbits of on-chip RAM (53,248,000 bits) to support buffering, on-chip storage, and memory-intensive algorithms.
• I/O Capacity 432 user I/Os to accommodate wide parallel interfaces and extensive peripheral connectivity.
• Package & Mounting 1517-FBGA (40×40) supplier device package designed for surface-mount assembly.
• Power Specified core voltage supply range from 820 mV to 880 mV to define power and supply design limits.
• Temperature & Grade Industrial grade operation with an operating temperature range of −40 °C to 100 °C.
• Standards Compliance RoHS compliant, meeting common lead-free manufacturing requirements.

Typical Applications

• High-density digital systems — Implement complex logic functions and system integration where large logic capacity and embedded memory are needed.
• Data buffering and on-chip storage — Leverage approximately 53 Mbits of embedded RAM for packet buffering, FIFO, and scratchpad memory requirements.
• Large I/O count designs — Use 432 I/Os for broad parallel interfaces, multi-channel sensor or actuator arrays, and board-level connectivity.

Unique Advantages

• Substantial logic resources: The device offers approximately 597,000 logic elements to implement large, complex designs without partitioning across multiple devices.
• Significant on-chip memory: Approximately 53 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• High I/O density: 432 user I/Os enable flexible interface options and simplify board routing for multi-channel systems.
• Industrial temperature rating: Rated for −40 °C to 100 °C operation to support demanding temperature environments.
• Compact BGA package: 1517-FBGA (40×40) surface-mount package balances footprint and thermal/mechanical considerations for system assembly.
• RoHS compliant: Meets environmental requirements for lead-free production flows.

Why Choose 5SGXEB6R2F40I2L?

This Stratix® V GX device combines high logic density, ample embedded memory, and a large I/O complement in an industrial-grade FBGA package, making it well suited to system designs that require substantial on-chip resources and robust environmental performance. Designers building complex FPGA-based systems who need scalability, plentiful on-chip RAM, and broad I/O capability will find this device aligned with those priorities.

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