5SGXEB6R2F40I2N

The 5SGXEB6R2F40I2N is a Stratix® V GX field programmable gate array from Intel, supplied in a 1517-FBGA (40×40) surface-mount package. It integrates large logic and memory resources alongside a high I/O count, and is offered as an industrial-grade device rated for operation from −40 °C to 100 °C.

Key architectural attributes include 597,000 logic elements and approximately 53.248 Mbits of embedded RAM, supporting complex, high-density digital designs that require extensive on-chip logic and memory capacity.

Key Features

• Logic Capacity  597,000 logic elements (logic cells) for implementing complex digital logic and system functions.
• Embedded Memory  Approximately 53.248 Mbits of on-chip RAM to support large buffering, state storage, and memory-intensive logic.
• I/O Connectivity  432 dedicated I/O pins to interface with peripherals, memory, and high-speed system buses.
• Power Supply  Core voltage supply range specified at 870 mV to 930 mV for the device core.
• Package & Mounting  1517-FBGA (40×40) supplier device package in a surface-mount form factor for compact PCB integration.
• Temperature & Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C for deployment in temperature-demanding environments.

Unique Advantages

• Large integrated logic and memory: Combines 597,000 logic elements with ~53.248 Mbits of embedded RAM to support dense, stateful designs on a single device.
• High I/O count for system integration: 432 I/O pins enable broad connectivity to external components and subsystems without extensive external glue logic.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C for reliability in industrial environments.
• Compact, surface-mount FBGA package: 1517-FBGA (40×40) package supports space-efficient PCB layouts and high pin density.
• Low-voltage core operation: Core supply range of 870 mV–930 mV supports designs targeting optimized core power domains.

Why Choose 5SGXEB6R2F40I2N?

The 5SGXEB6R2F40I2N positions itself for designs that require substantial on-chip logic and memory in an industrial-temperature FPGA. Its combination of nearly 600k logic elements, more than 53 Mbits of embedded RAM, and 432 I/O pins makes it suitable where integration density and extensive interfacing are primary requirements.

Engineers and procurement teams selecting this device gain a compact FBGA package, a defined low-voltage core supply range, and industrial-grade temperature support—attributes that contribute to scalable designs and robust operation in demanding deployment environments.

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