5SGXEB6R2F40I3LG

The 5SGXEB6R2F40I3LG is a Stratix V GX family FPGA IC designed for high-density logic and large on-chip memory requirements. As an industrial-grade, surface-mount 1517-FBGA device, it targets applications that require substantial logic capacity, extensive I/O, and robust operating temperature range.

Built on the Stratix V GX architecture, this device combines a large number of logic elements with significant embedded RAM and a wide I/O complement, offering a solid foundation for complex digital, I/O-intensive, and high-speed designs within the documented Stratix V GX family capabilities.

Key Features

• High Logic Capacity — 597,000 logic elements to implement large-scale combinational and sequential logic designs.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive algorithms.
• Extensive I/O — 432 user I/O pins for rich peripheral interfacing and high channel counts.
• GX Family Transceiver Context — Part of the Stratix V GX family; the family datasheet documents GX transceiver speed grades (for reference in system planning).
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Low-Voltage Core — Core supply range of 0.820 V to 0.880 V to match system power-rail design requirements.
• Package & Mounting — 1517-FBGA (40×40) package in a surface-mount form factor suitable for high-density board layouts.
• Regulatory Compliance — RoHS-compliant.

Typical Applications

• High-speed serial systems — Use in designs that leverage the Stratix V GX family transceiver capabilities for high-bandwidth serial links as documented by the family datasheet.
• Network and communications infrastructure — Large logic and on-chip memory enable packet processing, protocol offload, and buffering functions.
• Compute acceleration and signal processing — High logic element count and substantial embedded RAM support algorithm acceleration and streaming data operations.
• Industrial control and I/O aggregation — Industrial temperature rating and extensive I/O make the device suitable for demanding factory and instrumentation systems.

Unique Advantages

• Large programmable fabric — 597,000 logic elements provide the capacity to integrate complex functions and reduce external component count.
• Significant on-chip memory — Approximately 53.25 Mbits of RAM simplifies buffering and reduces dependence on external memory.
• High I/O density — 432 I/O pins enable high channel counts and flexible interfacing to peripherals and transceivers.
• Industrial robustness — −40 °C to 100 °C operating range supports deployment in industrial environments.
• Compact, manufacturable package — 1517-FBGA (40×40) surface-mount package supports high-density board designs and standard assembly processes.
• Controlled core voltage range — 0.820–0.880 V core supply range aids integration with modern FPGA power architectures.

Why Choose 5SGXEB6R2F40I3LG?

The 5SGXEB6R2F40I3LG delivers a combination of high logic capacity, ample on-chip RAM, and a wide I/O complement in an industrial-temperature, surface-mount FBGA package. It is positioned for development teams that need to implement large, memory-rich designs with substantial interfacing requirements while maintaining operation across a broad temperature range.

As a member of the Stratix V GX family, this device aligns with the documented family capabilities for high-performance designs and offers the specification set—logic elements, embedded memory, I/O count, package, and voltage—for scalable, long-term deployment in industrial and communications-focused systems.

Request a quote or submit a design inquiry to evaluate using the 5SGXEB6R2F40I3LG in your next project.