5SGXEB6R2F40I3LN

The 5SGXEB6R2F40I3LN is a Stratix V GX family FPGA packaged in a 1517-FBGA (40×40) surface-mount package. It combines a large logic fabric with extensive embedded RAM and a high I/O count for complex programmable-logic designs.

Offered in an industrial temperature grade (–40 °C to 100 °C) with a core supply range of 820 mV to 880 mV, this device is suited for designs that require significant on-chip resources and a robust operating temperature window.

Key Features

• Core Logic 597,000 logic elements and 225,400 logic array blocks (LABs) provide substantial capacity for large-scale RTL implementations.
• Embedded Memory Approximately 53.25 Mbits of embedded memory for on-chip storage, buffering, and state retention.
• I/O Count 432 programmable I/O pins to support broad interfacing requirements with external devices and systems.
• Package & Mounting 1517-FBGA (40×40) supplier device package, surface-mount mounting for compact board integration.
• Power Supply Core voltage supply specified from 820 mV to 880 mV to match platform power-rail requirements.
• Temperature Grade Industrial operating temperature range: –40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance RoHS compliant.
• Family Capabilities As a Stratix V GX device, the family documentation describes electrical and switching characteristics, including transceiver and I/O timing capabilities for designs that require advanced periphery performance.

Typical Applications

• High-density programmable logic — Designs requiring extensive logic capacity and embedded memory can leverage the 597,000 logic elements and ~53.25 Mbits of on-chip RAM to implement complex algorithms and control logic.
• High I/O systems — Systems that need a large number of external interfaces can use the 432 I/O pins for broad connectivity and peripheral integration.
• Industrial and harsh-environment equipment — The –40 °C to 100 °C operating range supports deployments where wider temperature margins are required.

Unique Advantages

• Large on-chip resource pool: Nearly 600k logic elements and substantial embedded RAM enable consolidation of functions onto a single device, reducing board space and BOM complexity.
• High I/O density: 432 I/Os provide flexibility for interfacing multiple peripherals, memory devices, and system buses without immediate need for external I/O expanders.
• Industrial temperature rating: Specified for –40 °C to 100 °C operation, enabling use in temperature-challenging deployments.
• Compact BGA package: 1517-FBGA (40×40) offers a high-pin-count, space-efficient solution for dense board layouts.
• Standards-aligned family documentation: Device electrical and switching characteristics are covered in the Stratix V device datasheet, supporting engineering evaluation and system-level integration.

Why Choose 5SGXEB6R2F40I3LN?

The 5SGXEB6R2F40I3LN positions itself as a high-capacity Stratix V GX FPGA option for engineers who need large logic density, ample embedded memory, and a high I/O count in an industrial-temperature-rated package. Its combination of resources and package density makes it suitable for consolidating complex functions on a single device and supporting systems with broad interfacing needs.

Backed by Stratix V family documentation and specifications, this device provides a clear, specification-driven foundation for system design, verification, and deployment where on-chip resources and operational temperature range are key selection criteria.

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