5SGXEB6R2F43C1N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 597000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 236 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 225400 | Number of Logic Elements/Cells | 597000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXEB6R2F43C1N – Stratix® V GX Field Programmable Gate Array (FPGA) IC, 1760-FCBGA, 600 I/O
The 5SGXEB6R2F43C1N is a Stratix® V GX family FPGA in a 1760‑ball FCBGA package, designed for high‑density programmable logic implementations. It provides a large logic fabric, substantial on‑chip memory, and a high pin count to support complex digital systems and multi‑interface designs.
Targeted at commercial applications, this device delivers approximately 597,000 logic elements, roughly 53.25 Mbits of embedded memory, and 600 user I/Os in a surface‑mount 1760‑FCBGA (42.5 × 42.5 mm) package, enabling integration of sophisticated functions within a single device footprint.
Key Features
- High‑density logic Approximately 597,000 logic elements to implement large combinational and sequential logic blocks.
- Embedded memory Approximately 53.25 Mbits of on‑chip RAM for buffering, LUT‑based storage and state retention within the FPGA fabric.
- Extensive I/O 600 user I/O pins to support high port counts, multi‑lane interfaces, and broad system connectivity.
- Package and mounting 1760‑FCBGA (1760‑BBGA) package, 42.5 × 42.5 mm, surface mount for high‑density board designs.
- Power and supply Core voltage supply range of 870 mV to 930 mV to match system power designs requiring low‑voltage core rails.
- Commercial temperature grade Rated for 0 °C to 85 °C operating temperature for standard commercial deployments; RoHS compliant.
Typical Applications
- High‑performance signal processing Large logic capacity and significant embedded RAM make this device suitable for DSP functions, packet processing, and real‑time data manipulation.
- Networking and communications High I/O count supports multi‑lane interfaces and complex protocol bridging in communication equipment and network endpoints.
- System integration and aggregation Combine many discrete functions into a single FPGA‑based subsystem to reduce board area and component count.
- Prototype and platform development Use the large fabric and memory to evaluate complex architectures and accelerate time‑to‑market for custom silicon replacement or system validation.
Unique Advantages
- Large programmable fabric Offers the scale required for multi‑module designs and complex finite state machines without immediate need for multiple FPGAs.
- Significant on‑chip memory Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching tasks.
- High I/O density 600 I/Os enable extensive peripheral and interface connectivity directly from the FPGA, simplifying system routing and reducing glue logic.
- Compact, manufacturable package 1760‑FCBGA surface‑mount package supports high‑density PCB implementations while maintaining a standardized assembly process.
- Commercial readiness Commercial temperature grading and RoHS compliance make the device suitable for a wide range of enterprise and industrial‑adjacent systems.
Why Choose 5SGXEB6R2F43C1N?
This Stratix® V GX FPGA balances very large logic capacity, substantial embedded memory, and a high I/O count within a single 1760‑FCBGA package, making it a strong choice for designers needing to consolidate complex digital functions into one device. Its commercial temperature rating and RoHS compliance support deployment in standard enterprise and embedded applications.
Engineers and system architects requiring scalable logic resources, significant on‑chip RAM, and broad connectivity will find this device suitable for accelerating development and reducing system BOM complexity while leveraging documentation and support for the Stratix V family.
Request a quote or submit a procurement inquiry for part number 5SGXEB6R2F43C1N to get pricing and availability tailored to your project needs.

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