5SGXEB6R2F43C2

The 5SGXEB6R2F43C2 is a Stratix® V GX field-programmable gate array (FPGA) IC offering very large logic capacity and on-chip memory for high-density designs. It combines 597,000 logic elements with approximately 53.248 Mbits of embedded RAM and 600 user I/Os to support complex digital systems and high I/O integration.

Housed in a 1760-ball FCBGA (42.5 × 42.5 mm) surface-mount package and rated for commercial operation (0 °C to 85 °C), this device targets applications that require substantial logic, abundant I/O, and series-level Stratix V GX transceiver capabilities as documented in the family datasheet.

Key Features

• Logic Capacity  597,000 logic elements provide extensive fabric for implementing large state machines, datapaths, and custom accelerators.
• Logic Array Blocks  225,400 logic array blocks as specified for detailed mapping and resource planning.
• Embedded Memory  Approximately 53.248 Mbits of on-chip RAM to support large buffers, FIFOs, and on-chip data storage.
• I/O Density  600 user I/O pins enable high-connectivity designs requiring many external interfaces, parallel buses, or multiple high-pin-count peripherals.
• Package and Mounting  1760-FCBGA (42.5 × 42.5 mm) surface-mount package for high-density board integration.
• Power Supply  Core voltage supply range 870 mV to 930 mV for system power planning and regulator selection.
• Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
• Series Transceiver Information  Stratix V GX family transceiver speed grades are documented in the series datasheet (family-level information includes GX channel grades up to 14.1 Gbps), useful when planning high-speed serial links.

Typical Applications

• High-density digital processing  Large logic and memory resources enable implementation of complex data-paths, custom accelerators, and timing-critical processing chains.
• Network and communications equipment  High I/O count and family-level transceiver capability support multiport and high-bandwidth interface designs.
• Prototyping and system integration  Extensive logic and on-chip memory make the device suitable for emulation, FPGA prototyping, and integration of large HDL designs.
• Signal processing and packet buffering  Substantial embedded RAM capacity supports buffers, FIFOs, and intermediate data storage for DSP workloads.

Unique Advantages

• High integration density: With 597,000 logic elements and large embedded RAM, the device consolidates complex functions into a single FPGA, reducing external component count.
• Abundant I/O resources: 600 user I/Os allow direct interfacing to many peripherals and parallel interfaces without extensive multiplexing.
• Clear power envelope: Defined core voltage range (870 mV–930 mV) simplifies power supply design and regulator selection.
• Commercial temperature suitability: Rated for 0 °C to 85 °C, appropriate for a wide range of commercial and enterprise applications.
• Standard surface-mount packaging: 1760-FCBGA (42.5 × 42.5 mm) enables dense PCB layouts and compatibility with common high-pin-count assembly processes.
• RoHS compliant: Conforms to RoHS requirements for lead-free assembly and regulatory alignment.

Why Choose 5SGXEB6R2F43C2?

The 5SGXEB6R2F43C2 positions itself for designs that demand very large logic capacity, significant embedded memory, and high I/O density in a single commercial-grade FPGA package. Its package and power specifications help streamline board-level integration while the series-level Stratix V GX transceiver information supports planning for high-speed serial interfaces.

Choose this device for complex system integration, high-throughput data paths, and FPGA-based prototyping where consolidated logic, memory, and I/O reduce BOM complexity and simplify system architecture.

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