5SGXEB6R2F40C3G

The 5SGXEB6R2F40C3G is a Stratix V GX family FPGA offering a high-density programmable fabric with 597,000 logic elements and approximately 53.25 Mbits of embedded memory. As a Stratix V GX device, it provides a combination of large logic capacity, abundant on-chip RAM, and a broad set of I/O for complex digital designs.

Designed for commercial temperature environments, this surface-mount 1517-FBGA (40×40) packaged device supports 432 I/O pins and operates from a 0.820 V to 0.880 V supply, making it suitable for designs that require substantial logic resources and flexible I/O integration.

Key Features

• High Logic Capacity – 597,000 logic elements to implement complex finite state machines, datapaths, and custom accelerators.
• Embedded Memory – Approximately 53.25 Mbits of on-chip RAM for buffering, LUT-based storage, and memory-intensive functions.
• Rich I/O – 432 I/O pins to support extensive peripheral interfacing and board-level connectivity.
• Package & Mounting – 1517-FBGA (40×40) supplier device package in a surface-mount form factor for compact board integration.
• Power – Core voltage supply range of 0.820 V to 0.880 V to match system power architecture requirements.
• Temperature Grade – Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Regulatory – RoHS compliant.

Typical Applications

• High-density logic integration – Use the large logic element count and on-chip RAM to consolidate multiple functions into a single FPGA for complex digital systems.
• Data buffering and packet handling – Leverage the significant embedded memory to implement FIFOs, packet buffers, and other memory-intensive blocks.
• Custom accelerator and signal processing – Apply the abundant logic and RAM resources to implement compute-intensive datapaths and custom processing engines.

Unique Advantages

• Substantial on-chip resources: 597,000 logic elements and ~53.25 Mbits of embedded memory reduce the need for external components and simplify board design.
• Large I/O count: 432 I/O pins provide flexibility for complex board-level interfaces and multiple peripheral connections.
• Compact package: 1517-FBGA (40×40) surface-mount package enables high-density PCB layouts while retaining accessibility to many signals.
• Commercial temperature suitability: Rated for 0 °C to 85 °C to match standard commercial deployments and system environments.
• RoHS compliant: Conforms to RoHS environmental requirements for modern electronics manufacturing.

Why Choose 5SGXEB6R2F40C3G?

The 5SGXEB6R2F40C3G delivers a balance of very high logic capacity, substantial embedded memory, and extensive I/O in a compact surface-mount FBGA package. Its specification set addresses designs that require significant on-chip resources and dense connectivity within a commercial temperature envelope.

Engineers and procurement teams designing complex digital systems can rely on this Stratix V GX device to consolidate functionality, reduce external BOM, and support scalable implementations where large programmable fabric and embedded RAM are key determinants.

Request a quote or submit a product inquiry today to evaluate the 5SGXEB6R2F40C3G for your next high-density FPGA design.