5SGXEB6R2F43C2N

The 5SGXEB6R2F43C2N is an Intel Stratix V GX Field Programmable Gate Array supplied in a 1760-FCBGA (42.5 × 42.5 mm) package. It delivers a large logic fabric, substantial embedded memory, and a high pin count for complex, high-density digital designs.

Designed for commercial-grade systems, this device targets applications that require significant on-chip logic resources, extensive I/O connectivity, and controlled core-power operation within a specified commercial temperature range.

Key Features

• Logic Capacity — Contains 597,000 logic elements, providing a large programmable fabric for complex digital functions and custom logic implementation.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for buffering, lookup tables, and data storage close to logic.
• I/O Density — 600 user I/O pins to support wide parallel interfaces and high-pin-count system designs.
• Package — 1760-BBGA, FCBGA package; supplier device package specified as 1760-FCBGA (42.5 × 42.5 mm) for compact, high-density board integration.
• Power Supply — Core supply voltage range of 0.870 V to 0.930 V for defined core-power planning and design.
• Mounting — Surface-mount device suitable for standard PCB assembly processes.
• Temperature Grade — Commercial grade operation from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density digital systems — Implement complex logic, custom processing pipelines, and large-scale state machines using the extensive logic element count.
• On-chip memory buffering — Use the embedded ~53.25 Mbits of RAM for packet buffering, frame storage, or deep FIFO implementations close to logic.
• Multi-interface platforms — Leverage 600 I/O pins to connect to multiple peripherals, parallel buses, and board-level interfaces.

Unique Advantages

• Large programmable fabric: 597,000 logic elements enable substantial custom logic integration without offloading functions to external devices.
• Significant embedded memory: Approximately 53.25 Mbits of on-chip RAM reduces external memory dependency and shortens data paths.
• High I/O count: 600 I/O pins support complex board-level interconnect and high-channel count interfaces.
• Compact, high-density package: 1760-FCBGA (42.5 × 42.5 mm) provides a balance of density and manufacturability for space-constrained systems.
• Defined core voltage range: 0.870–0.930 V core supply simplifies power-rail planning for the device core.
• Commercial temperature operation: Rated for 0 °C to 85 °C to match standard commercial system requirements.

Why Choose 5SGXEB6R2F43C2N?

The 5SGXEB6R2F43C2N combines a large logic capacity, substantial embedded memory, and a high number of I/O to address demanding commercial FPGA designs that require extensive on-chip resources. Packaged in a 1760-FCBGA footprint and operating on a defined core voltage range, it supports compact, high-density board implementations while conforming to commercial temperature requirements.

For engineers and procurement teams building complex digital platforms, this Stratix V GX device provides a well-defined set of resources and package characteristics that simplify system-level planning and integration, backed by Intel's Stratix V family documentation.

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