5SGXEB6R2F43I2G

IC FPGA 600 I/O 1760FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 597000 1760-BBGA, FCBGA

Quantity 1,862 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs225400Number of Logic Elements/Cells597000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEB6R2F43I2G – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXEB6R2F43I2G is a Stratix V GX FPGA featuring a large logic and memory footprint together with high I/O density in a 1760-FCBGA package. It provides 597,000 logic elements and approximately 53.25 Mbits of embedded RAM in a surface-mount 1760-FCBGA (42.5 × 42.5 mm) package.

Designed for industrial-grade deployments, this device supports a broad operating range and low-voltage core operation, enabling integration of substantial programmable logic, on-chip memory, and dense I/O in a single component.

Key Features

  • Core Logic  597,000 logic elements to implement complex programmable logic and high-density designs.
  • Embedded Memory  Total on-chip RAM of 53,248,000 bits (approximately 53.25 Mbits) for buffering, state storage, and memory-intensive functions.
  • I/O Density  Up to 600 general-purpose I/O pins to support high-pin-count interfaces and parallel connectivity.
  • Power  Core voltage supply range from 870 mV to 930 mV for the device core domain.
  • Package & Mounting  1760-FCBGA (1760-BBGA footprint) package, 42.5 × 42.5 mm; surface-mount for high-density board designs.
  • Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for extended-environment use.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • Large on-chip resources: 597,000 logic elements combined with approximately 53.25 Mbits of embedded RAM reduce the need for external logic and memory components.
  • High I/O capacity: 600 I/O pins let you route many interfaces directly to the FPGA, simplifying board-level integration for dense systems.
  • Industrial temperature capability: Rated for −40 °C to 100 °C to meet thermal requirements of industrial applications.
  • Compact high-density package: 1760-FCBGA (42.5 × 42.5 mm) delivers a high-pin-count solution in a single FCBGA package for space-constrained designs.
  • Low-voltage core operation: Core supply between 870 mV and 930 mV supports designs optimized for the device’s power architecture.
  • Regulatory alignment: RoHS compliance supports environmentally conscious procurement and manufacturing processes.

Why Choose 5SGXEB6R2F43I2G?

The 5SGXEB6R2F43I2G positions itself as a high-capacity Stratix V GX FPGA option for industrial applications that require significant programmable logic, substantial embedded memory, and dense I/O in a single package. Its combination of 597,000 logic elements, approximately 53.25 Mbits of on-chip RAM, and 600 I/Os in a 1760-FCBGA footprint helps consolidate multiple functions onto one device, reducing board complexity and component count.

This device is suited for development teams and procurement organizations focused on scalable, robust FPGA solutions where industrial temperature range, RoHS compliance, and a high resource count are priorities. The published Stratix V device datasheet provides series-level electrical and switching characteristics useful for system design and validation.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the 5SGXEB6R2F43I2G.

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