5SGXEB6R2F43C3N

The 5SGXEB6R2F43C3N is an Intel Stratix V GX family FPGA packaged in a 1760‑FBGA (42.5 × 42.5 mm) surface‑mount package. It provides a high density of logic and embedded memory with a large I/O count for complex, board‑level digital designs.

Designed for commercial temperature operation, this device targets high‑density logic and memory applications where large I/O capacity and series‑level Stratix V GX electrical and switching characteristics are required.

Key Features

• Core logic density  Approximately 597,000 logic elements, enabling large-scale programmable logic implementation.
• Embedded memory  Approximately 53.25 Mbits of on‑chip RAM for buffering, lookup tables, and state storage.
• I/O resources  600 I/O pins to support dense peripheral and bus interfacing on complex boards.
• Package & mounting  1760‑FBGA (1760‑FCBGA) surface‑mount package, 42.5 × 42.5 mm footprint for compact board integration.
• Power supply  Core voltage range of 820 mV to 880 mV, as specified for device operating conditions.
• Temperature and grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Standards & compliance  RoHS compliant.
• Series electrical and switching characteristics  The Stratix V device datasheet documents electrical and switching characteristics, including operating conditions and transceiver speed grade options for the Stratix V GX family.

Typical Applications

• High‑density digital processing  Large logic element count and embedded memory make this device suitable for complex FPGA implementations and heavy parallel processing tasks.
• High‑speed I/O systems  Extensive I/O count supports dense board‑level interfacing and connectivity for multi‑lane or multi‑bus designs.
• Communication and transceiver‑enabled designs  As a Stratix V GX family member, the device aligns with the family’s transceiver and switching feature set for high‑speed data link applications (see device datasheet for series‑level transceiver specifications).

Unique Advantages

• High logic integration: The large number of logic elements enables consolidation of multiple functions into a single FPGA, reducing system complexity.
• Substantial on‑chip memory: Approximately 53.25 Mbits of embedded RAM supports deep buffering and stateful logic without reliance on external memory.
• Extensive board connectivity: 600 I/O pins provide flexibility for wide parallel interfaces, multiple peripherals, and rich I/O routing on complex PCBs.
• Compact, manufacturable package: 1760‑FCBGA surface‑mount package offers a high‑density footprint suitable for modern board designs.
• Commercial temperature rating: Rated from 0 °C to 85 °C for standard commercial applications and deployments.
• Regulatory compliance: RoHS compliant to support current environmental requirements.

Why Choose 5SGXEB6R2F43C3N?

The 5SGXEB6R2F43C3N delivers a balance of very high logic density, significant on‑chip memory, and broad I/O capacity in a compact FCBGA package. Its commercial temperature grade and documented Stratix V GX series electrical and switching characteristics make it suitable for demanding board‑level designs where integration density and I/O flexibility are priorities.

This device is well suited to engineering teams building complex digital systems that require scalable logic resources, substantial embedded RAM, and extensive connectivity while maintaining commercial operating specifications and RoHS compliance.

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