5SGXEB6R2F43I2LG
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 597000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 704 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 225400 | Number of Logic Elements/Cells | 597000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXEB6R2F43I2LG – Stratix® V GX Field Programmable Gate Array (FPGA) IC
The 5SGXEB6R2F43I2LG is a Stratix® V GX field programmable gate array (FPGA) IC in a 1760-FCBGA package. It provides large logic capacity and on-chip memory in an industrial-grade device designed for demanding embedded and system-level applications.
This device combines a high count of logic elements and embedded RAM with 600 user I/Os, a narrow core supply range (820–880 mV), and an industrial operating temperature window (−40 °C to 100 °C), enabling dense, high-capacity FPGA implementations in surface-mount form factors.
Key Features
- Logic Capacity Provides 597,000 logic elements for complex digital designs and large-scale gateware integration.
- Embedded Memory Approximately 53.25 Mbits of embedded RAM to support deep buffering, data storage, and on-chip memory structures.
- I/O and Package 600 user I/Os in a 1760-BBGA (1760-FCBGA) package; supplier package dimension listed as 1760-FCBGA (42.5 × 42.5 mm). Surface-mount mounting type simplifies board assembly for high-density designs.
- Power Requirements Core voltage supply range of 820–880 mV to match system power-rail planning and regulator selection.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Regulatory Compliance RoHS compliant to support restricted-substance requirements in product builds.
Unique Advantages
- High logic density: 597,000 logic elements provide the capacity to consolidate multiple functions and IP blocks on a single device, reducing board-level complexity.
- Substantial on-chip RAM: Approximately 53.25 Mbits of embedded memory supports large buffering and memory-mapped resources without external memory reliance.
- Large I/O count: 600 I/Os enable broad external interfacing options for peripherals, high-pin-count buses, and multi-channel systems.
- Industrial-rated operation: −40 °C to 100 °C operating range suits deployments in temperature-challenging industrial environments.
- Compact high-density package: 1760-FCBGA (42.5 × 42.5 mm) package provides a balance of pin count and PCB footprint for space-constrained designs.
- RoHS compliant: Facilitates integration into products requiring restricted-substance compliance.
Why Choose 5SGXEB6R2F43I2LG?
The 5SGXEB6R2F43I2LG positions itself as a high-capacity Stratix V GX FPGA option for designs that require extensive logic resources, large embedded RAM, and a high I/O count within a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for production systems that demand environmental robustness and regulatory alignment.
This device is appropriate for teams scaling complex digital systems where on-chip integration and a large fabric reduce external components and simplify PCB design. Choosing this Stratix V GX part is a way to leverage substantial on-die resources in industrial-grade FPGA deployments.
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