5SGXEB6R2F43I3

The 5SGXEB6R2F43I3 is a Stratix V GX field programmable gate array (FPGA) in a 1760-FCBGA package, designed for high-density, industrial-grade logic integration. It combines a large logic capacity with substantial embedded RAM and a high I/O count to address complex digital designs that demand integration, configurability, and robust operating range.

Key Features

• Core Logic  597,000 logic elements provide extensive programmable logic capacity for complex algorithms and large-scale state machines.
• Logic Array Blocks  225,400 logic array blocks (LABs) to structure and partition designs across the device fabric.
• Embedded Memory  Approximately 53.248 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive functions without external memory.
• I/O Resources  600 user I/O pins to support wide parallel interfaces, numerous peripherals, or multi-channel I/O architectures.
• Power Supply  Core voltage operating range of 820 mV to 880 mV for defined power delivery and core performance control.
• Package  1760-FCBGA (42.5 × 42.5 mm) BGA package for high-density board integration and thermal/mechanical stability.
• Industrial Grade  Rated for industrial operation with an operating temperature range of –40 °C to 100 °C.
• Standards & Compliance  RoHS compliant to meet common environmental and regulatory sourcing requirements.
• Stratix V GX Family  Part of the Stratix V GX device family; device documentation covers industrial and commercial speed grade options and transceiver characteristics for the family.

Typical Applications

• High-density digital systems  Use the 597,000 logic elements and extensive LAB count to implement large-scale state machines, custom accelerators, and complex control logic on a single device.
• Memory-intensive processing  Approximately 53.248 Mbits of embedded RAM supports buffering and data-path storage for DSP pipelines, packet buffering, and streaming applications.
• Multi-interface I/O platforms  600 I/Os enable wide parallel buses, multiple peripheral channels, or high-channel-count I/O subsystems for instrumentation and communication gateways.
• Industrial control and automation  Industrial temperature rating (–40 °C to 100 °C) supports deployment in factory automation, process control, and other industrial environments.

Unique Advantages

• High integration density: Large logic element count and LAB capacity reduce the need for multiple FPGAs or external glue logic, simplifying board design.
• On-chip memory for system-level functions: Approximately 53.248 Mbits of embedded RAM enables internal buffering and state storage, lowering external memory dependency.
• Extensive I/O availability: 600 I/Os accommodate complex interface requirements and parallel connectivity without multiplexing compromises.
• Industrial temperature support: Rated –40 °C to 100 °C for resilient operation across a wide range of environmental conditions.
• Compact, high-density package: 1760-FCBGA (42.5 × 42.5 mm) footprint supports high pin-count designs while providing a reliable form factor for production boards.
• Regulatory alignment: RoHS compliance helps streamline component selection for environmentally regulated products.

Why Choose 5SGXEB6R2F43I3?

The 5SGXEB6R2F43I3 positions itself as a high-capacity, industrial-grade Stratix V GX FPGA suited to demanding digital systems that require substantial logic resources, on-chip memory, and a large I/O complement. Its defined core voltage range, robust operating temperature window, and high-density FCBGA package make it appropriate for designs that prioritize integration and environmental resilience.

Engineers and procurement teams looking to consolidate functionality, reduce external components, and scale complex designs will find the device’s combination of logic, memory, and I/O particularly valuable. Documentation for the Stratix V family provides guidance on operating conditions, power, and transceiver options to support system-level planning.

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