5SGXEB6R2F43I3L

The 5SGXEB6R2F43I3L is a Stratix® V GX Field Programmable Gate Array (FPGA) offered in a 1760-FCBGA package. This industrial-grade device provides substantial programmable logic capacity, on-chip memory, and high I/O density for complex, high-density FPGA designs.

Key device attributes include approximately 597,000 logic elements, approximately 53.2 Mbits of embedded memory, and 600 I/O pins, making it suitable for designs that require large logic resources and extensive external connectivity.

Key Features

• Core & Architecture 
  Stratix V GX family FPGA architecture as indicated in the device datasheet series information.
• Logic Capacity 
  Approximately 597,000 logic elements for substantial programmable logic implementation.
• Embedded Memory 
  Approximately 53.2 Mbits of on-chip RAM (total RAM bits: 53,248,000) to support large buffering, lookup tables, and memory-intensive functions.
• I/O Density 
  600 I/O pins to accommodate broad external interfacing and high pin-count designs.
• Package & Mounting 
  1760-BBGA / 1760-FCBGA package (42.5 × 42.5 mm) with surface-mount assembly for high-density board integration.
• Power 
  Core supply voltage range of 820 mV to 880 mV as specified for device operation.
• Temperature & Grade 
  Industrial temperature grade with operating range of −40°C to 100°C.
• Compliance 
  RoHS-compliant to meet standard environmental requirements.

Unique Advantages

• High logic capacity: Approximately 597,000 logic elements enable large-scale FPGA implementations without partitioning to multiple devices.
• Significant embedded memory: Approximately 53.2 Mbits of on-chip RAM reduces external memory dependencies for buffering and state storage.
• Extensive I/O support: 600 I/Os provide flexibility for complex interfaces and high connector/count system designs.
• Industrial temperature rating: Operation from −40°C to 100°C supports deployment in industrial environments that require wider temperature margins.
• High-density packaging: 1760-FCBGA (42.5 × 42.5 mm) allows compact PCB layouts while accommodating large resource counts.

Why Choose 5SGXEB6R2F43I3L?

The 5SGXEB6R2F43I3L provides an integrated solution for designs that demand large programmable logic capacity, substantial embedded memory, and high I/O counts in an industrial-grade FPGA. Its combination of approximately 597,000 logic elements, roughly 53.2 Mbits of on-chip RAM, and 600 I/Os delivers the resource set needed for complex, high-density implementations.

This device is appropriate for engineering teams and procurement looking for a high-capacity Stratix V GX FPGA in a 1760-FCBGA package with industrial temperature capability and RoHS compliance, offering a balance of integration and board-level density for demanding applications.

Request a quote or submit a sales inquiry to discuss availability, pricing, and lead times for part number 5SGXEB6R2F43I3L.