5SGXEB6R2F43I3G

The 5SGXEB6R2F43I3G is an Intel Stratix V GX family FPGA delivered in a 1760‑FCPGA (42.5 × 42.5 mm) FCBGA package for surface‑mount assembly. It provides high logic capacity, substantial embedded RAM, and a large bank of user I/O for demanding, high‑density implementions.

Targeted at industrial applications, this device combines approximately 597,000 logic elements, roughly 53.25 Mbits of embedded memory, and 600 user I/Os, enabling complex custom logic, protocol handling, and high‑pin-count system integration while operating over an industrial temperature range.

Key Features

• Core Logic  Approximately 597,000 logic elements for large-scale programmable logic implementations.
• Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM to support large buffers, FIFOs, and memory‑intensive algorithms.
• User I/O  600 I/Os to support high‑density interfacing, wide datapaths, and multiple parallel interfaces.
• Package  1760‑FBGA (FCBGA) supplier package, 42.5 × 42.5 mm, designed for surface‑mount PCB assembly.
• Power and Core Voltage  Specified core voltage supply range of 820 mV to 880 mV.
• Temperature Grade  Industrial operating temperature range: −40 °C to 100 °C.
• Compliance  RoHS compliant.
• Manufacturer and Family  Intel Stratix V GX FPGA, with device electrical and switching characteristics documented in the Stratix V device datasheet.

Typical Applications

• High‑density I/O systems  Large I/O count and abundant logic resources support complex board‑level aggregation and custom interface glue logic.
• Signal processing and buffering  Significant on‑chip RAM provides storage for streaming data, buffering, and pipeline stages in real‑time processing chains.
• Communications and networking  Stratix V GX family devices are suitable where large programmable logic capacity and numerous I/Os are required for protocol handling and packet processing.

Unique Advantages

• High logic density: Approximately 597,000 logic elements enable implementation of complex, multi‑module designs on a single device.
• Substantial on‑chip memory: Around 53.25 Mbits of embedded RAM reduces reliance on external memory for many buffering and stateful functions.
• Extensive I/O resources: 600 user I/Os facilitate wide data paths and multiple peripheral connections without external multiplexing.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in applications requiring extended environmental range.
• Compact FCBGA package: 1760‑FCBGA (42.5 × 42.5 mm) provides a high‑pin‑count solution in a surface‑mount form factor for dense PCB designs.
• Low‑voltage core operation: Core supply range of 820–880 mV supports designs targeting modern low‑voltage power architectures.

Why Choose 5SGXEB6R2F43I3G?

The 5SGXEB6R2F43I3G brings large‑scale programmable logic, extensive on‑chip RAM, and a high I/O count in a single industrial‑grade Stratix V GX FPGA. This makes it well suited to engineers who need to consolidate complex functions, reduce board‑level components, and support high‑density interfaces in applications that require operation across an extended temperature range.

Backed by Intel’s Stratix V device documentation and specifications, the part is appropriate for development flows that demand documented electrical and switching characteristics and a proven FPGA family foundation.

Request a quote or submit a pricing inquiry to evaluate 5SGXEB6R2F43I3G for your next high‑density FPGA design.