5SGXEB6R3F40C2L

The 5SGXEB6R3F40C2L is a Stratix V GX family field‑programmable gate array (FPGA) offered in a commercial temperature grade. It provides large-scale programmable logic with 597,000 logic elements and approximately 53 Mbits of embedded memory, plus 432 user I/Os in a compact 1517‑FBGA (40×40) package.

Designed for complex digital designs that require high logic density and significant on‑chip RAM, the device supports surface‑mount assembly and operates from a core supply range of 820 mV to 880 mV. The included datasheet details electrical and switching characteristics, transceiver and I/O timing, and operating requirements for Stratix V devices.

Key Features

• Core Logic  Approximately 597,000 logic elements for implementing complex custom logic and large FPGA designs.
• Embedded Memory  Approximately 53 Mbits of on‑chip RAM to support large buffering, state storage, and memory‑intensive functions.
• I/O Capacity  432 user I/Os to interface with external devices, peripherals, and board‑level systems.
• Package & Mounting  1517‑FBGA (40×40) package in a surface‑mount format for high‑density PCB integration.
• Power Supply  Core voltage specified between 820 mV and 880 mV for device operation.
• Commercial Grade Temperature  Rated for operation from 0 °C to 85 °C (commercial temperature range).
• Standards Compliance  RoHS‑compliant for lead‑free manufacturing requirements.
• Documentation  Datasheet includes electrical and switching characteristics, I/O timing, and guidance for operating conditions for Stratix V devices.

Typical Applications

• High‑density digital processing  Large logic capacity and substantial on‑chip RAM for complex algorithms, custom accelerators, and bit‑level data processing.
• Communications and networking  High I/O count and Stratix V GX family attributes (as documented in the device family datasheet) suit board designs requiring extensive protocol interfacing and programmable datapaths.
• Prototyping and system integration  Surface‑mount 1517‑FBGA package and high logic density make the device suitable for board‑level prototyping of advanced digital systems.

Unique Advantages

• Substantial logic capacity: With 597,000 logic elements, the device enables large, integrated FPGA designs without external logic partitioning.
• Significant embedded memory: Approximately 53 Mbits of on‑chip RAM reduces dependency on external memory for buffering and state retention.
• High I/O count: 432 user I/Os simplify interfacing multiple peripherals and high‑pin‑count subsystems on a single device.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C aligns with standard commercial deployments and development environments.
• RoHS compliant: Supports lead‑free assembly and regulatory requirements for modern electronics manufacturing.
• Compact FBGA package: 1517‑FBGA (40×40) keeps board footprint compact while providing high pin density for complex designs.

Why Choose 5SGXEB6R3F40C2L?

This Stratix V GX device combines large programmable logic capacity, substantial on‑chip RAM, and a high I/O count in a compact 1517‑FBGA package—making it well suited for system designs that require integration of extensive custom logic and memory resources while maintaining a dense board footprint. Its commercial‑grade temperature range and RoHS compliance align with standard product development and manufacturing flows.

Engineers and procurement teams seeking a high‑capacity Stratix V GX FPGA for advanced digital, communications, or prototyping applications will find the 5SGXEB6R3F40C2L a straightforward option for integrating large programmable systems with documented electrical and switching characteristics available in the Stratix V device datasheet.

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