5SGXEB6R3F40C2N

The 5SGXEB6R3F40C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 1517-FBGA (40×40) package. This commercial-grade device delivers high logic density, substantial on-chip memory, and a large I/O count for complex, I/O‑intensive FPGA designs.

Engineered for designs that require extensive programmable logic and embedded memory, the device targets applications where integration of large amounts of logic and data storage is essential while operating within a commercial 0 °C to 85 °C range.

Key Features

• High logic density — 597,000 logic elements and 225,400 LABs provide a large programmable fabric for complex algorithms and multi‑function systems.
• Significant embedded memory — approximately 53.25 Mbits of on‑chip RAM to support buffering, FIFOs, and data‑intensive compute tasks.
• Extensive I/O — 432 user I/O pins for broad peripheral connectivity and system interfacing.
• Power and core supply — specified core supply voltage range of 870 mV to 930 mV to align with the device’s operating requirements.
• Package and mounting — 1517‑FBGA (40×40) supplier device package, surface‑mount mounting type for compact board implementation.
• Commercial temperature grade — rated for 0 °C to 85 °C operation for mainstream electronic applications.
• RoHS compliant — meets RoHS environmental compliance requirements.

Typical Applications

• High-density digital signal processing — large logic and on‑chip RAM capacity supports real‑time DSP, filtering, and multi‑channel processing.
• Network and data‑plane functions — high logic resources and abundant I/O enable packet processing, protocol handling, and custom switching logic.
• Compute acceleration and custom hardware — use the fabric and memory to offload compute‑intensive kernels and hardware accelerators.
• Instrumentation and test systems — ample I/O and memory make the device suitable for high‑channel count measurement, capture, and control applications.

Unique Advantages

• Large programmable fabric: 597,000 logic elements give designers headroom for complex state machines, datapaths, and multi‑core implementations.
• Substantial embedded memory: approximately 53.25 Mbits of RAM reduces the need for external memory in many buffering and streaming scenarios.
• High I/O capacity: 432 I/Os simplify system integration by supporting numerous parallel interfaces and peripherals without expensive IO expansion.
• Compact FBGA packaging: 1517‑FBGA (40×40) delivers a high‑density assembly option for space‑constrained PCBs while remaining surface‑mount compatible.
• Commercial temperature rating: specified 0 °C to 85 °C operation for deployments in mainstream electronics and industrially oriented equipment that operate within this range.
• Regulatory alignment: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXEB6R3F40C2N?

The 5SGXEB6R3F40C2N combines one of the Stratix V GX family’s high logic capacities with large on‑chip memory and a substantial I/O complement in a compact 1517‑FBGA package. It is suited for designers who need to consolidate complex functions and memory‑heavy processing into a single FPGA while maintaining a commercial temperature profile and RoHS compliance.

For projects demanding scalable programmable logic, extensive embedded RAM, and broad interfacing capability, this device offers a balanced combination of density, integration, and package convenience backed by the Stratix V family documentation.

If you would like pricing, availability, or to request a formal quote for the 5SGXEB6R3F40C2N, submit an inquiry with your quantity and delivery requirements and our team will respond with the next steps.