5SGXEB6R3F40C2LN

The 5SGXEB6R3F40C2LN is a Stratix® V GX field‑programmable gate array (FPGA) IC providing high logic density and substantial on‑chip memory in a 1517‑FBGA (40×40) package. As a Stratix V GX device, it is part of Intel’s Stratix V family designed for applications that require significant programmable logic capacity and extensive embedded RAM.

This commercial‑grade FPGA offers a wide set of silicon resources—including 597,000 logic elements and approximately 53.248 Mbits of embedded memory—along with 432 I/O pins, making it suitable for designs that demand large, integrated programmable logic fabrics.

Key Features

• Logic Capacity — 597,000 logic elements to implement large, complex digital functions and system logic.
• Logic Array Blocks — 225,400 logic array blocks provide structured resources for scalable logic partitioning.
• Embedded Memory — Approximately 53.248 Mbits of on‑chip RAM for buffering, lookup tables, and data paths.
• I/O Count — 432 I/O pins to support extensive peripheral and interface connectivity requirements.
• Package & Mounting — 1517‑FBGA (40×40) package, surface‑mount for compact board integration.
• Power Supply — Core voltage supply range of 820 mV to 880 mV for defined power domain design.
• Operating Grade & Temperature — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS‑compliant for reduced hazardous substance content.

Typical Applications

• High‑density digital processing — Use the large logic and memory resources to implement complex signal processing and compute‑intensive logic.
• System integration and prototyping — Consolidate multiple functions into a single FPGA to accelerate design validation and reduce board-level BOM.
• High‑pin‑count interface designs — Leverage 432 I/O for extensive peripheral connectivity and multi‑lane interface implementations.

Unique Advantages

• Substantial on‑chip resources: 597,000 logic elements and ~53.248 Mbits of embedded RAM enable dense implementation of complex algorithms without excessive external memory.
• High I/O density: 432 I/O pins simplify system partitioning and reduce the need for external multiplexing.
• Commercial operating range: Rated for 0 °C to 85 °C, suitable for mainstream commercial electronic products.
• Compact package integration: 1517‑FBGA (40×40) surface‑mount package supports compact board layouts while providing a high pin count.
• Regulatory compliance: RoHS status compliant, aligning with environmental and manufacturing requirements.

Why Choose 5SGXEB6R3F40C2LN?

The 5SGXEB6R3F40C2LN positions itself as a high‑capacity commercial Stratix V GX FPGA that balances large programmable logic fabric and significant embedded memory within a compact FBGA package. It is well suited for development teams and system designers who need considerable on‑chip resources and a high I/O count for consolidated, high‑complexity designs.

Select this FPGA when your design priorities include dense logic implementation, substantial internal RAM, and a commercial temperature profile—backed by the Stratix V family’s documented electrical and switching characteristics.

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