5SGXEB9R2H43C2LG

The 5SGXEB9R2H43C2LG is a Stratix® V GX FPGA IC from Intel, delivering very large programmable logic capacity and extensive I/O for complex system designs. Built for high-density, programmable logic applications, it pairs 840,000 logic elements with approximately 53 Mbits of embedded memory and up to 600 I/Os to support demanding on-board processing and interface integration.

This device is supplied in a 1760-BBGA (FCBGA) package with a 1760-HBGA (45×45) supplier package variant, operates with a core supply range of 820 mV to 880 mV, and is graded for commercial temperature operation from 0 °C to 85 °C. It is RoHS compliant and designed for surface-mount PCB assembly.

Key Features

• Core Logic Capacity  840,000 logic elements for large-scale, highly parallel programmable logic implementations.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM to support buffering, LUTs, and data-path storage without external memory.
• I/O Resources  Up to 600 I/O pins to enable dense connectivity to peripherals, memories, and high-speed interfaces.
• Power Supply  Core voltage supply range of 820 mV to 880 mV to match system power-rail design requirements.
• Package & Mounting  Delivered in a 1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45). Surface-mount mounting type for standard PCB assembly.
• Operating Temperature  Commercial-grade operation from 0 °C to 85 °C for typical commercial and enterprise applications.
• Compliance  RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

• High-density FPGA designs  Implement large custom logic networks and complex state machines using the device's 840,000 logic elements and abundant embedded memory.
• Data-path acceleration  On-chip memory and extensive I/O enable buffering and parallel processing for packet handling, signal processing, and hardware acceleration tasks.
• Prototyping and system integration  Use the device as a platform for integrating multiple functions and interfaces on a single FPGA for board-level prototyping and system consolidation.

Unique Advantages

• Large programmable fabric: 840,000 logic elements reduce the need for multiple FPGAs in high-density designs, simplifying system architecture.
• Significant on-chip memory: Approximately 53 Mbits of embedded RAM supports deep buffering and local data storage to improve throughput and reduce external memory bandwidth requirements.
• Extensive I/O availability: Up to 600 I/Os provide flexible connectivity options for multi-channel interfaces and peripheral integration.
• Compact, surface-mount package: The 1760-BBGA/1760-HBGA package enables high pin-count in a controlled PCB footprint for dense board layouts.
• Commercial temperature rating: Operates from 0 °C to 85 °C to meet typical commercial and enterprise deployment environments.
• RoHS compliance: Supports lead-free manufacturing requirements for modern electronics supply chains.

Why Choose 5SGXEB9R2H43C2LG?

The 5SGXEB9R2H43C2LG offers a combination of very large logic capacity, substantial embedded memory, and extensive I/O in a high-pin-count BGA package—making it suitable for dense, integrated FPGA designs where consolidation and on-chip resources matter. Its commercial-grade temperature rating and RoHS compliance align with mainstream production and regulatory needs.

This device is targeted at designs that require substantial programmable logic and memory resources on a single FPGA, such as compute acceleration, complex protocol handling, and multifunction system prototypes. Designers can rely on the detailed electrical and switching characteristics provided in the Stratix V documentation when validating power and timing for their systems.

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