5SGXEB9R2H43C2N

The 5SGXEB9R2H43C2N is a Stratix V GX field programmable gate array (FPGA) by Intel, built for high‑density programmable logic implementations. The device combines a large logic fabric, substantial on‑chip RAM, and extensive I/O to address demanding digital designs that require parallel processing and flexible interfacing.

With a core voltage supply range of 870 mV to 930 mV and a commercial operating temperature range of 0 °C to 85 °C, this surface‑mount FCBGA FPGA is suitable for commercial embedded and communications applications that need high gate and memory capacity in a 1760‑ball package.

Key Features

• High Logic Density  Approximately 840,000 logic elements to implement large, complex digital designs and parallel processing architectures.
• Embedded Memory  Approximately 53.248 Mbits of on‑chip RAM for FIFOs, buffering, and on‑chip data storage to support data‑intensive functions.
• I/O Capacity  600 user I/O pins to support broad connectivity to external peripherals, transceivers, and high‑speed interfaces.
• Package and Mounting  1760‑BBGA (FCBGA) package with supplier device package 1760‑HBGA (45×45) in a surface‑mount form factor for compact, high‑pin‑count board designs.
• Power and Voltage  Core voltage supply range: 870 mV to 930 mV, enabling regulated core operation consistent with Stratix V family requirements.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial environment deployments.
• RoHS Compliant  Device is RoHS compliant to support environmental and regulatory requirements.

Typical Applications

• High‑performance signal processing  Use the large logic element count and ample embedded memory for real‑time DSP, image processing, and algorithm acceleration.
• Networking and communications  Leverage high I/O count and Stratix V GX platform capabilities for packet processing, protocol bridging, and programmable interface logic.
• Data buffering and aggregation  Embedded RAM capacity supports large buffering requirements in data acquisition, storage controllers, and streaming applications.

Unique Advantages

• Substantial programmable fabric: The device’s ~840k logic elements enable implementation of complex state machines, datapaths, and parallel compute structures without external ASIC dependence.
• On‑chip memory for system efficiency: Approximately 53.248 Mbits of embedded RAM reduce external memory bandwidth needs and simplify board‑level BOM.
• High I/O count for flexible interfacing: 600 I/Os offer design freedom to connect multiple peripherals, high‑speed SERDES, or multi‑lane interfaces.
• Commercial temperature and RoHS compliance: Commercial grade 0 °C to 85 °C rating and RoHS compliance support broad deployment in commercial products while meeting environmental standards.
• Compact, high‑pin package: 1760‑BBGA (FCBGA) package provides a dense footprint for space‑constrained PCBs while exposing a high number of I/Os and signals.

Why Choose 5SGXEB9R2H43C2N?

The 5SGXEB9R2H43C2N delivers a balance of high logic density, significant embedded memory, and extensive I/O in a commercial‑grade Stratix V GX FPGA footprint. Its specifications make it well suited to system designs that require large programmable resources, substantial on‑chip buffering, and flexible interfacing in a compact surface‑mount package.

Designed as part of the Stratix V family, this device is appropriate for teams building high‑performance digital systems that benefit from scalable FPGA resources and the documentation and device specifications provided with the Stratix V device datasheet.

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