5SGXEB9R2H43C3G

The 5SGXEB9R2H43C3G is a Stratix V GX field programmable gate array (FPGA) offered in a 1760-BBGA FCBGA package. It delivers very large programmable logic capacity with extensive embedded memory and a high I/O count for demanding digital designs.

Designed for commercial-grade applications, this device targets high-density logic implementations that require significant on-chip memory, large numbers of I/O, and advanced performance characteristics indicated in the Stratix V device datasheet.

Key Features

• Core Logic  840,000 logic elements to support complex programmable logic and large-scale integration.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM (53,248,000 bits) for local data storage and buffering.
• I/O Capacity  600 user I/O pins to support dense peripheral and interface connectivity.
• Power Supply  Core voltage range of 820 mV to 880 mV as specified for device operation.
• Package and Mounting  1760-BBGA (FCBGA) package, supplier device package listed as 1760-HBGA (45×45), with surface-mount assembly.
• Operating Grade and Temperature  Commercial grade device rated for 0 °C to 85 °C ambient operating temperature.
• Stratix V GX Family Characteristics  The Stratix V device documentation describes GX devices and their transceiver/core speed grade offerings within the family.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Use the large logic capacity to implement complex state machines, custom datapaths, and algorithm accelerators directly in programmable logic.
• Memory-intensive FPGA functions  Leverage approximately 53 Mbits of embedded memory for packet buffering, FIFOs, and on-chip data structures.
• High I/O interface systems  Utilize the 600 I/Os for multi-channel sensor interfaces, parallel buses, and wide peripheral connectivity.

Unique Advantages

• Substantial logic resources: 840,000 logic elements enable consolidation of multiple functions into a single device, reducing overall system complexity.
• Significant embedded memory: Approximately 53 Mbits of RAM supports data buffering and local storage, lowering dependence on external memory devices.
• High I/O density: 600 I/Os provide flexibility to interface with numerous peripherals and parallel data paths without auxiliary I/O expanders.
• Compact system footprint: 1760-BBGA FCBGA packaging and surface-mount mounting support dense PCB layouts for space-constrained designs.
• Commercial-grade specification: Rated for 0 °C to 85 °C operation to match a wide range of commercial embedded applications.
• Standards alignment: RoHS compliance supports global electronic manufacturing requirements.

Why Choose 5SGXEB9R2H43C3G?

The 5SGXEB9R2H43C3G combines very large programmable logic capacity, substantial on-chip memory, and a high I/O count in a single commercial-grade Stratix V GX FPGA package. It is suited to designs that require integration of complex digital logic, extensive buffering, and broad connectivity while maintaining a compact PCB footprint.

This device is appropriate for engineering teams and system designers targeting scalable, high-density programmable solutions that align with the Stratix V family specifications and the commercial operating envelope provided in the datasheet.

Request a quote or submit an inquiry for pricing and availability to evaluate the 5SGXEB9R2H43C3G for your next design.