5SGXEB9R2H43I2G

The 5SGXEB9R2H43I2G is an Intel Stratix® V GX field programmable gate array (FPGA) supplied in a 1760‑ball BGA package. It integrates a very large programmable fabric together with extensive on‑chip memory and a high I/O count to support complex digital designs.

Key capabilities exposed in the device data include 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and 600 user I/Os. The device is offered in an industrial temperature grade with a core supply range of 870 mV to 930 mV and is provided as a surface‑mount 1760‑BBGA/FCBGA package (supplier package: 1760‑HBGA, 45×45).

Key Features

• Programmable Logic Capacity — 840,000 logic elements enable large, complex FPGA implementations and multi‑function designs.
• Embedded Memory — Approximately 53.25 Mbits of on‑chip RAM for buffering, state storage, and data‑path acceleration within the FPGA fabric.
• High I/O Count — 600 user I/Os to support wide parallel interfaces, multiple peripherals, and board‑level connectivity.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Core Power Supply — Core voltage specified at 870 mV to 930 mV for the device core supply domain.
• Package and Mounting — Surface‑mount 1760‑BBGA, FCBGA package (supplier device package: 1760‑HBGA, 45×45) for board‑level integration.
• Stratix V GX Device Family — Device belongs to the Stratix V GX family with device datasheet coverage for electrical, switching, and transceiver characteristics.

Typical Applications

• Industrial Control and Automation — Industrial temperature rating and large I/O count support complex control logic, sensor aggregation, and machine‑level interfaces.
• High‑Speed Serial and Interface Processing — Stratix V GX family documentation includes transceiver and I/O timing specifications suited for designs requiring advanced serial interfacing.
• High‑Density Logic Implementations — Large logic element and embedded memory capacity enable multi‑channel signal processing, protocol offload, and custom compute tasks on a single device.

Unique Advantages

• Large, Integrated Fabric — 840,000 logic elements reduce the need for multiple devices when implementing complex designs.
• Substantial On‑Chip Memory — Approximately 53.25 Mbits of embedded RAM minimizes external memory dependencies for many data‑intensive functions.
• High Connectivity — 600 I/Os provide flexibility for parallel buses, peripheral interfaces, and mixed signal routing on dense PCBs.
• Industrial Reliability — Rated for −40 °C to 100 °C operation to meet industrial deployment temperature requirements.
• Board‑Level Integration — Surface‑mount 1760‑BBGA package (1760‑HBGA supplier package) for compact, high‑pin‑count board layouts.
• Well‑Documented Device Family — Electrical and switching characteristics for the Stratix V family are covered in the device datasheet, aiding design validation.

Why Choose 5SGXEB9R2H43I2G?

The 5SGXEB9R2H43I2G positions itself where large programmable capacity, abundant embedded memory, and extensive I/O converge in an industrial‑grade Stratix V GX FPGA. Its combination of 840,000 logic elements, roughly 53.25 Mbits of on‑chip RAM, and 600 I/Os supports integration of complex functions and high‑density interfaces on a single device, simplifying board design and reducing component count.

This device is suitable for engineers and system designers who need large FPGA resources in a surface‑mount 1760‑ball BGA package with an industrial operating range and defined core voltage requirements. The Stratix V family documentation provides the electrical and transceiver characteristics necessary for system‑level validation and deployment planning.

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