5SGXEB9R2H43I2LN

The 5SGXEB9R2H43I2LN is a Stratix® V GX Field Programmable Gate Array (FPGA) optimized for high-density programmable logic and large I/O interfacing. Built on the Stratix V GX family, this device delivers 840,000 logic elements and approximately 53.25 Mbits of embedded memory to support complex digital designs.

With up to 600 user I/O, an industrial operating temperature range and a low-voltage core (820 mV–880 mV), this surface-mount FCBGA device is specified for systems that require high integration, significant on-chip resources and robust thermal tolerance.

Key Features

• High-density logic  840,000 logic elements for implementing large-scale digital designs and complex custom logic.
• Embedded memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, lookup tables and embedded data storage.
• Large I/O count  600 user I/O pins to enable extensive external interfacing and parallel connectivity.
• Low-voltage core  Core voltage supply specified at 820 mV to 880 mV for device operation and power budgeting.
• Industrial temperature grade  Rated for operation from −40 °C to 100 °C to meet industrial-environment system requirements.
• Package and mounting  1760-BBGA (FCBGA) surface-mount package with supplier package reference 1760-HBGA (45×45) for compact, high-density board designs.
• Regulatory compliance  RoHS compliant

Typical Applications

• High-speed communications and networking  Large logic density and extensive I/O make the device suitable for protocol processing and packet handling in networking equipment.
• Data center and compute acceleration  Substantial embedded memory and logic resources enable hardware acceleration blocks and custom data-path implementations.
• Signal processing and instrumentation  High logic capacity and wide I/O support complex DSP pipelines, real-time processing and multi-channel acquisition systems.

Unique Advantages

• High on-chip integration: 840,000 logic elements and ~53.25 Mbits of embedded RAM reduce external component count and simplify board-level design.
• Extensive I/O capacity: 600 user I/O pins enable broad peripheral connectivity and parallel interfaces without additional multiplexing logic.
• Industrial-grade operation: Specified −40 °C to 100 °C for reliable operation in demanding thermal environments.
• Compact FCBGA package: 1760-BBGA (1760-HBGA 45×45 supplier footprint) supports high-density PCB layouts while maintaining thermal and electrical performance.
• Low-voltage core operation: 820 mV–880 mV supply range supports power-sensitive system architectures and precise power budgeting.
• RoHS compliance: Meets modern environmental and manufacturing requirements.

Why Choose 5SGXEB9R2H43I2LN?

The 5SGXEB9R2H43I2LN provides a balance of high logic density, substantial embedded memory and large I/O capability in a compact FCBGA package tailored for industrial environments. Its specifications make it well suited for engineers developing high-performance communications, data acceleration and signal processing systems that require significant on-chip resources and robust thermal range.

Choosing this Stratix V GX device supports designs that need scalable, integrated FPGA resources with clearly defined electrical and thermal parameters for system-level planning and deployment.

Request a quote or submit an inquiry to receive pricing, lead-time and availability information for the 5SGXEB9R2H43I2LN.