5SGXEB9R2H43I3L

IC FPGA 600 I/O 1760HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 840000 1760-BBGA, FCBGA

Quantity 1,160 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1760-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEB9R2H43I3L – Stratix® V GX Field Programmable Gate Array (FPGA), 600 I/O, 840,000 Logic Elements

The 5SGXEB9R2H43I3L is a Stratix V GX Field Programmable Gate Array from Intel designed for high-density, high-performance digital systems. As a Stratix V GX device, it combines a large logic fabric with substantial on-chip RAM and a high I/O count to address demanding communications, signal processing, and industrial applications.

Key attributes include 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and 600 I/O pins, all in a 1760‑BBGA (FCBGA) package with an industrial operating temperature range and low-voltage supply requirements.

Key Features

  • Core Logic Density 840,000 logic elements provide extensive resources for implementing complex custom logic, datapaths, and accelerators.
  • Embedded Memory Approximately 53.25 Mbits of on‑chip RAM for buffering, FIFOs, and on‑chip data storage to reduce external memory dependence.
  • I/O Capacity 600 user I/O pins support wide parallel interfaces and numerous peripheral connections for system integration.
  • Transceiver Capability (Series) As a Stratix V GX family device, the series supports GX transceiver channel speed grades described in the series datasheet (transceiver capabilities vary by speed grade).
  • Power Supply Operates with a specified voltage supply range of 820 mV to 880 mV, enabling predictable core power planning.
  • Package and Mounting Supplied in a 1760‑BBGA (FCBGA) package; supplier device package noted as 1760‑HBGA (45×45). Surface-mount mounting type simplifies PCB assembly.
  • Industrial Temperature Grade Rated for operation from –40 °C to 100 °C, suitable for industrial environments where extended temperature range is required.
  • Standards Compliance RoHS compliant, meeting common environmental and material requirements.

Typical Applications

  • High‑speed communications Use the Stratix V GX family transceiver capabilities for multi‑Gbps links and network interface implementations (transceiver performance depends on speed grade).
  • Signal processing and acceleration The combination of 840,000 logic elements and large embedded RAM supports intensive signal processing pipelines and hardware accelerators.
  • I/O‑dense system controllers With 600 I/O pins, the device is suited for applications requiring numerous parallel interfaces to sensors, memory, or peripherals.
  • Industrial systems Industrial temperature rating (–40 °C to 100 °C) and surface-mount packaging make the device suitable for robust control and automation electronics.

Unique Advantages

  • High integration density: 840,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
  • Large on‑chip RAM: Approximately 53.25 Mbits of embedded memory lowers external memory requirements and improves system throughput.
  • Extensive I/O: 600 user I/Os provide flexibility for complex interfacing, simplifying system partitioning and reducing external bridge components.
  • Industrial robustness: –40 °C to 100 °C operating range supports deployment in demanding environments without additional thermal qualification claims.
  • Predictable power planning: Narrow voltage supply range (820–880 mV) aids in precise power-supply design and core power budgeting.
  • RoHS compliant: Meets standard material and environmental directives for modern electronics production.

Why Choose 5SGXEB9R2H43I3L?

The 5SGXEB9R2H43I3L positions itself as a high‑density Stratix V GX FPGA option for designers who need a substantial logic fabric, large on‑chip memory, and a high I/O count within an industrial temperature envelope. Its specified voltage range and package options enable controlled power and mechanical design choices for complex systems.

This device is suitable for teams implementing high‑performance communications links, compute‑intensive signal processing, and I/O‑rich controllers who require the resources and environmental range provided by the Stratix V GX family and Intel’s FPGA platform.

If you would like pricing, lead‑time information, or to request a formal quote for the 5SGXEB9R2H43I3L, submit a quote request or inquiry and a representative will respond with availability and ordering details.

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