5SGXEB9R2H43I3N

The 5SGXEB9R2H43I3N is an Intel Stratix V GX field-programmable gate array (FPGA) in a 1760-BBGA (FCBGA) package. It delivers high logic density and extensive I/O in a surface-mount, industrial-grade device suitable for complex programmable logic implementations.

With 840,000 logic elements and approximately 53.25 Mbits of embedded memory, this Stratix V GX part targets designs that require large programmable fabric, significant on-chip RAM, and a high I/O count while operating across a wide industrial temperature range.

Key Features

• Core Logic 840,000 logic elements and 317,000 LABs provide substantial programmable fabric for complex logic and datapath implementations.
• Embedded Memory Approximately 53.25 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Density 600 I/O pins to support large external connectivity and multi-channel interfacing.
• Power Supply Core voltage supply range of 820 mV to 880 mV to match intended system power architectures.
• Package & Mounting 1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45). Designed for surface-mount assembly.
• Operating Range & Grade Industrial-grade device rated for operation from −40°C to 100°C.
• Compliance RoHS-compliant for environmental and manufacturing requirements.
• Family Transceiver Capability (see datasheet) Stratix V GX family documentation includes transceiver speed-grade information for high-speed serial channels.

Typical Applications

• Telecommunications & Networking Use the large logic capacity and high I/O count for packet processing, protocol offload, and line-card functionality.
• Data Center & Compute Acceleration Leverage on-chip RAM and abundant logic elements for custom acceleration tasks, buffering, and data-path acceleration in rack-mounted systems.
• Test, Measurement & Instrumentation Implement complex signal processing, real-time analysis, and I/O-rich measurement front ends within a single FPGA package.
• Industrial Control & Automation Industrial temperature rating and high I/O density support control systems, motion control, and real-time automation logic.

Unique Advantages

• High Integration: 840,000 logic elements and substantial on-chip RAM reduce the need for external ASICs and memory, simplifying system BOM.
• Large I/O Capability: 600 I/Os enable multi-channel interfaces and complex peripheral integration without extensive external multiplexing.
• Industrial Temperature Range: Rated from −40°C to 100°C for deployment in temperature-demanding environments.
• Surface-Mount, High-Density Package: 1760-BBGA / 1760-HBGA (45×45) packaging provides a condensed footprint for space-constrained PCB designs.
• Standards Compliance: RoHS compliance supports modern manufacturing and regulatory requirements.
• Documented Family-Level Transceiver Options: Stratix V GX family documentation includes transceiver speed-grade data to inform high-speed serial design decisions.

Why Choose 5SGXEB9R2H43I3N?

The 5SGXEB9R2H43I3N positions itself as a high-density Stratix V GX FPGA option for engineers needing extensive programmable logic, significant on-chip memory, and broad I/O in an industrial-grade device. Its combination of 840,000 logic elements, approximately 53.25 Mbits of embedded RAM, and 600 I/Os supports complex, integration-heavy designs where consolidating functionality into a single FPGA reduces system complexity.

This device is suited to teams building telecommunications equipment, data center accelerators, instrumentation, and industrial automation systems that require scalable logic resources, robust thermal performance, and a compact surface-mount BGA footprint. Refer to the device datasheet for family-level electrical and transceiver specifications when finalizing system design and power requirements.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the 5SGXEB9R2H43I3N Stratix V GX FPGA.