5SGXEB9R2H43I3LN

The 5SGXEB9R2H43I3LN is a Stratix V GX Field Programmable Gate Array (FPGA) IC designed for industrial-grade applications. It delivers very high logic capacity, abundant embedded memory, and a large I/O complement in a surface-mount, 1760-ball BGA package.

Engineered as part of the Stratix V family, this device targets designs that require dense programmable logic, significant on-chip RAM, and extensive connectivity while operating across an industrial temperature range.

Key Features

• Logic Capacity  Approximately 840,000 logic elements and 317,000 LABs/CLBs provide high-density programmable logic for complex digital designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive processing.
• I/O and Connectivity  600 user I/O pins enable wide external interfacing and parallel connectivity for I/O‑heavy applications.
• Package  1760-ball BGA (FCBGA / 1760-HBGA 45×45 mm footprint) in a surface-mount form factor for high‑density board integration.
• Power Supply  Core supply operating range of 820 mV to 880 mV to match system power-rail requirements.
• Temperature and Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Regulatory  RoHS compliant.
• Family Characteristics  Part of the Stratix V GX family; consult the Stratix V device datasheet for detailed electrical and switching characteristics and speed-grade information.

Typical Applications

• Industrial Control  Industrial-grade operating range and high logic density support complex control algorithms, real-time processing, and large I/O counts for factory automation and process control systems.
• Communications and Networking  Large I/O complement and Stratix V GX family characteristics support I/O‑intensive networking and communications equipment.
• Digital Signal Processing  Substantial logic resources and embedded memory enable DSP tasks such as filtering, packet processing, and custom accelerators.

Unique Advantages

• High logic and routing density: Approximately 840,000 logic elements and 317,000 LABs/CLBs reduce the need for multiple devices in complex designs.
• Significant on-chip RAM: Approximately 53.25 Mbits of embedded memory minimizes external memory dependence and simplifies board design.
• Extensive I/O capability: 600 user I/Os enable broad peripheral interfacing and parallel data paths for system integration.
• Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in harsh environments.
• High-density BGA package: 1760-ball package with a 45×45 mm supplier package footprint supports compact, high-performance PCBs.
• RoHS compliant: Conforms to lead-free manufacturing requirements for many industrial procurement processes.

Why Choose 5SGXEB9R2H43I3LN?

The 5SGXEB9R2H43I3LN combines very high logic density, substantial embedded memory, and a large I/O count in an industrial-grade Stratix V GX FPGA package. This balance of capacity and environmental robustness makes it suitable for engineers designing complex programmable logic solutions that must operate reliably in demanding conditions.

As a member of the Stratix V family, this device benefits from the family's documented electrical and switching characteristics; it is well suited to teams needing scalable FPGA resources, dense memory integration, and a high degree of I/O flexibility.

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