5SGXEB9R3H43C2L

The 5SGXEB9R3H43C2L is a Stratix® V GX family FPGA from Intel, delivering a high-density programmable fabric with extensive on-chip memory and large I/O capability. It targets designs that require substantial logic resources, embedded RAM, and broad I/O connectivity in a surface-mount 1760-BBGA (45 × 45 mm) package.

As part of the Stratix V GX series, the device is specified for commercial temperature operation and supports the family’s transceiver performance and I/O timing features described in the Stratix V device documentation.

Key Features

• Logic Density  Approximately 840,000 logic elements, enabling complex logic and routing for large-scale digital designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive functions.
• I/O Capacity  600 user I/O pins to accommodate wide parallel interfaces and numerous peripheral connections.
• Power Supply  Core voltage range of 820 mV to 880 mV to match system-level power planning and regulator design.
• Package & Mounting  1760-BBGA FCBGA package (supplier package: 1760-HBGA, 45 × 45 mm) with surface-mount assembly for compact board-level integration.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant per the product data.
• Series Transceiver Capability  Stratix V GX family documentation lists transceiver speed grades (for the series) including options up to 14.1 Gbps, providing context for high-speed serial designs.

Typical Applications

• High-speed serial communications  Leverage the Stratix V GX family transceiver capabilities for designs that require high-bandwidth serial links.
• High-density digital processing  Use the large logic element count and embedded RAM for complex state machines, protocol processing, and data-path acceleration.
• I/O-intensive systems  Support extensive peripheral interfacing, large bus widths, and multiple parallel interfaces with 600 available I/Os.

Unique Advantages

• High logic capacity:  Approximately 840,000 logic elements provide the resources needed for large, integrated FPGA designs without immediate partitioning to multiple devices.
• Substantial on-chip memory:  Approximately 53.25 Mbits of embedded RAM reduces external memory dependence for buffering and data staging.
• Extensive I/O count:  600 I/Os simplify board-level design by accommodating many external interfaces directly on-chip.
• Compact, industry-standard package:  1760-BBGA (45 × 45 mm) surface-mount package balances density and manufacturability for medium- to high-complexity boards.
• Low-voltage core operation:  820 mV–880 mV core supply supports efficient power architectures and regulator selection.
• RoHS compliant:  Meets environmental compliance requirements for modern assemblies.

Why Choose 5SGXEB9R3H43C2L?

5SGXEB9R3H43C2L positions itself as a high-density, high-I/O Stratix V GX FPGA option from Intel, suitable for designs that demand large logic resources, significant on-chip RAM, and broad connectivity in a compact surface-mount BGA package. Its commercial-grade operating window and family-level transceiver capabilities make it appropriate for complex communication and processing tasks where integration and board-level I/O counts are priorities.

Choosing this device provides a route to consolidate functions onto a single FPGA fabric while leveraging the Stratix V series documentation and ecosystem for design support and integration guidance.

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