5SGXEBBR2H43I2

The 5SGXEBBR2H43I2 is a Stratix® V GX field programmable gate array (FPGA) from Intel, offered in an industrial temperature grade. It delivers very high logic capacity and on-chip memory in a high-pin-count FCBGA package, suitable for dense, I/O-rich digital designs.

Key attributes visible in the device data include 952,000 logic elements, approximately 53.25 Mbits of embedded memory, 600 user I/Os, and operation over a wide industrial temperature range.

Key Features

• Logic Capacity  952,000 logic elements for large, complex programmable logic implementations.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• I/O and Connectivity  600 user I/Os to accommodate high pin-count interfaces and multi-channel system integration.
• Power and Core Supply  Core voltage supply range of 870 mV to 930 mV for defined operating conditions.
• Package and Mounting  1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45). Surface-mount mounting type.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• RoHS Compliant  Conforms to RoHS environmental requirements.
• Stratix V GX Family  Part of the Stratix V device family; datasheet materials reference Stratix V GX devices and their electrical and switching characteristics.

Typical Applications

• High-density FPGA designs  Use cases requiring large programmable logic resources and substantial embedded RAM, enabled by 952,000 logic elements and ~53.25 Mbits of memory.
• I/O‑intensive systems  Designs that need many external interfaces and parallel channels can take advantage of the device’s 600 user I/Os.
• Industrial and temperature-challenging deployments  Systems requiring operation across −40 °C to 100 °C benefit from the device’s industrial temperature grade.
• Compact, high-pin-count PCB designs  Surface-mount FCBGA 1760 package (1760-HBGA, 45×45) supports dense board integration where area and pin count are critical.

Unique Advantages

• High logic density: 952,000 logic elements enable implementation of large-scale digital functions on a single device, reducing the need for multiple FPGAs.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM supports large buffering and local data storage for high-throughput designs.
• Extensive I/O capability: 600 user I/Os provide flexibility for multi-protocol interfaces, parallel buses, and large channel counts.
• Industrial temperature rating: −40 °C to 100 °C operation suits applications exposed to wide environmental temperature ranges.
• High‑pin-count FCBGA package: 1760‑BBGA (supplier 1760‑HBGA, 45×45) balances pin density and board-level integration for compact designs.
• Defined core voltage envelope: 870–930 mV supply specification provides a clear operating window for power system design.

Why Choose 5SGXEBBR2H43I2?

The 5SGXEBBR2H43I2 delivers a combination of very high logic capacity, substantial embedded memory, and extensive I/O in a single industrial-grade Stratix V GX device. Its FCBGA 1760 package and defined core voltage range make it suitable for dense, high-pin-count boards and systems that require predictable electrical and thermal behavior.

Designed for engineers building complex, I/O-rich systems that must operate across industrial temperature ranges, this device provides the element count, on-chip RAM, and I/O resources needed to consolidate functionality while maintaining a clear specification set from the manufacturer.

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