5SGXEBBR2H43I3G

The 5SGXEBBR2H43I3G is a Stratix V GX field programmable gate array (FPGA) in a 1760-ball BGA FCBGA package, offered in an industrial temperature grade. It provides large-scale programmable logic and on-chip memory for designs that require a high logic count, substantial embedded RAM, and extensive I/O.

As a member of the Stratix V GX family, this device aligns with the family’s transceiver and core speed grade offerings and is intended for applications that leverage high-density logic, high-speed serial interfaces, and industrial temperature operation.

Key Features

• Core logic capacity — 952,000 logic elements for complex programmable logic implementations and system integration.
• Embedded memory — Approximately 53.25 Mbits of on-chip RAM to support large buffering, packet processing, and data-path storage.
• I/O density — 600 I/O pins to enable broad connectivity and multiple interface endpoints.
• Package and mounting — 1760-ball BBGA, FCBGA surface-mount package; supplier package listed as 1760-HBGA (45×45) for compact, high-density board designs.
• Power supply range — Core voltage supply specified from 820 mV to 880 mV for controlled power provisioning and thermal planning.
• Industrial temperature grade — Rated for operation from −40°C to 100°C to meet extended-temperature deployment requirements.
• Stratix V GX family transceiver capability — As part of the Stratix V GX family, the series supports transceiver speed grade options up to 14.1 Gbps (per Stratix V GX family documentation), enabling high-speed serial link implementations where required.
• Standards compliance — RoHS compliant.

Typical Applications

• High-performance networking — Suitable for packet processing and protocol acceleration where large logic resources and many I/Os are required.
• Telecommunications and serial link aggregation — Leverages Stratix V GX family transceiver capabilities for high-speed serial interfaces and backplane connectivity.
• Data-path and signal processing — Large on-chip RAM and logic element count support buffering, DSP pipelines, and custom dataflow engines.
• Industrial control and automation — Industrial temperature rating and high I/O count enable robust control and sensor/actuator interfacing in extended-temperature environments.

Unique Advantages

• Highly scalable logic capacity: 952k logic elements provide headroom for complex algorithms, wide datapaths, and multi-function integration.
• Substantial embedded memory: Approximately 53.25 Mbits of RAM reduces dependence on external memory for many buffering and caching use cases.
• High I/O count: 600 I/Os simplify board-level partitioning and support multiple parallel interfaces without external multiplexing.
• Industrial-temperature operation: Rated −40°C to 100°C for reliable performance in extended-temperature deployments.
• Compact, manufacturable package: 1760-ball FCBGA package with surface-mount mounting supports dense board layouts while maintaining high pin count.
• Defined core voltage window: 820–880 mV supply specification helps with power budgeting and thermal design.

Why Choose 5SGXEBBR2H43I3G?

5SGXEBBR2H43I3G positions itself for demanding FPGA applications that require very large logic arrays, significant on-chip RAM, and a high number of I/Os within an industrial temperature envelope. Its Stratix V GX family alignment provides access to transceiver-grade options and the documented family-level characteristics for high-speed serial interfaces.

This device is suited to engineering teams building complex networking, data-path, or industrial-control systems where integration density, memory capacity, and extended-temperature operation are key selection criteria. The combination of logic, memory, and packaging supports scalable designs and long-term deployment in industrial environments.

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