5SGXMA3E1H29C2LG

The 5SGXMA3E1H29C2LG is a Stratix V GX field programmable gate array from Intel, delivering high logic density and substantial on‑chip memory in a 780‑ball BGA package. This commercial‑grade FPGA integrates a large logic fabric and abundant I/O for complex digital design implementations.

With 340000 logic elements, approximately 19.456 Mbits of embedded memory, and 600 general‑purpose I/Os, this device is suited to designs that require dense logic implementation, significant memory bandwidth on‑chip, and extensive external connectivity while operating at a core supply range of 820 mV to 880 mV and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core density  340000 logic elements provide the capacity to implement large combinational and sequential logic networks for complex algorithms and control logic.
• Embedded memory  Approximately 19.456 Mbits of on‑chip RAM to support buffering, lookup tables, and intermediate data storage for high‑throughput designs.
• I/O count  600 I/Os enable broad external interfacing and parallel connectivity to peripherals, memory devices, and board‑level interfaces.
• Series transceiver capability (Stratix V GX)  Stratix V GX devices in this family support high‑speed GX transceivers (series specification shows GX channel capability up to 14.1 Gbps depending on speed grade), enabling high‑bandwidth serial links where required by the system design.
• Power and supply  Core voltage supply range 820 mV to 880 mV for compatibility with supported power‑domain designs and power sequencing.
• Package and mounting  780‑ball BGA (FCBGA) package; supplier device package listed as 780‑HBGA (33×33). Surface‑mount device suitable for standard PCB assembly flows.
• Operating grade and temperature  Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental compliance  RoHS compliant.

Typical Applications

• High‑performance digital signal processing  Large logic capacity and significant embedded RAM make this FPGA well suited for signal processing pipelines and real‑time data transformation.
• Network and communications infrastructure  Stratix V GX series transceiver capability and high I/O count support multi‑lane serial links and wide parallel interfaces used in routers, switches, and packet processing.
• Data acceleration and co‑processing  Dense logic and on‑chip memory allow custom accelerators and offload engines for compute‑intensive tasks.
• Complex system integration and prototyping  High I/O availability and large logic resources enable integration of multiple subsystems and rapid hardware prototyping on a single device.

Unique Advantages

• High logic capacity: 340000 logic elements enable integration of multi‑function systems and large algorithm implementations without immediate partitioning across multiple devices.
• Substantial on‑chip memory: Approximately 19.456 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary storage, simplifying board design and improving latency.
• Extensive I/O connectivity: 600 I/Os provide flexibility for interfacing to a wide range of peripherals and high‑pin‑count systems.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to match commercial product and development environments.
• Compact BGA packaging: 780‑ball FCBGA (780‑HBGA supplier package, 33×33) delivers high integration density while remaining compatible with surface‑mount assembly.
• RoHS compliant: Meets environmental compliance expectations for modern electronics manufacturing.

Why Choose 5SGXMA3E1H29C2LG?

The 5SGXMA3E1H29C2LG positions itself as a high‑density, commercially graded FPGA for complex digital systems that require a balance of logic resources, embedded memory, and extensive I/O. Its Stratix V GX family heritage brings series‑level high‑speed transceiver capabilities and a mature device architecture for demanding implementations.

This device is well suited to engineers and system designers building high‑performance signal processing, networking, or acceleration functions who need a single‑chip solution with significant on‑chip resources and predictable commercial operating characteristics.

Request a quote or submit a request for pricing and availability to evaluate 5SGXMA3E1H29C2LG for your next design.