5SGXMA3E1H29C2WN

The 5SGXMA3E1H29C2WN is a Stratix® V GX family FPGA from Intel, implemented in a high-density FCBGA package. It delivers substantial on-chip logic and memory resources together with a large I/O count to address designs that require dense programmable logic and extensive external connectivity.

Key device characteristics include 340,000 logic elements, approximately 19.456 Mbits of embedded memory, 600 I/Os, and a low-voltage core operating range of 870 mV–930 mV. The device is offered in a commercial temperature grade (0 °C to 85 °C) and is RoHS compliant.

Key Features

• Core Architecture  Stratix V GX family FPGA architecture implemented in this part number, providing large-scale programmable logic capacity.
• Logic Capacity  340,000 logic elements to support complex combinational and sequential logic designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• I/O Density  600 I/O pins to support wide parallel interfaces, multi-channel connectivity, and high-pin-count designs.
• Power and Core Voltage  Core supply range of 870 mV–930 mV to match system power rails and optimize core operation.
• Package and Mounting  780-ball BGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33). Surface-mount mounting type.
• Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Implement large-scale logic functions and complex state machines using the device's 340,000 logic elements and embedded RAM.
• Data buffering and packet processing  Leverage approximately 19.456 Mbits of on-chip memory and 600 I/Os for multi-channel buffering and parallel data paths.
• High-pin-count interface hubs  Use the 600 I/O pins in FCBGA packaging to aggregate and route signals across dense connector or mezzanine designs.

Unique Advantages

• High logic density: 340,000 logic elements provide the capacity needed for substantial programmable logic integration within a single device.
• Significant embedded memory: Approximately 19.456 Mbits of on-chip RAM reduces dependence on external memory for many buffering and LUT applications.
• Extensive I/O capability: 600 I/Os support complex, parallel interfaces and multiple external subsystems without immediate need for additional glue logic.
• Compact BGA package: 780-ball FCBGA in a 33×33 supplier footprint enables a high-pin-count implementation in a single-socket footprint for compact board layouts.
• Low-voltage core operation: Core supply range of 870 mV–930 mV supports modern low-voltage system architectures.
• Commercial-grade availability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.

Why Choose 5SGXMA3E1H29C2WN?

The 5SGXMA3E1H29C2WN combines large logic capacity, substantial on-chip memory, and a high I/O count in a single FCBGA package—making it suitable for designs that require dense integration of programmable logic and wide external interfacing. As a Stratix V GX device from Intel, it provides a clear specification set for teams targeting commercial-temperature applications with defined core-voltage requirements.

Choose this part when your design needs a single-chip solution for heavy logic workloads, significant embedded RAM, and broad I/O connectivity while maintaining a compact board footprint and RoHS compliance.

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