5SGXMA3E1H29I2N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 780-BBGA, FCBGA |
|---|---|
| Quantity | 159 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 128300 | Number of Logic Elements/Cells | 340000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGXMA3E1H29I2N – Stratix® V GX FPGA, 340,000 logic elements, 600 I/Os
The 5SGXMA3E1H29I2N is an Intel Stratix® V GX field-programmable gate array (FPGA) offered in a 780-BBGA FCBGA package. It delivers high logic capacity, large on-chip memory, and a broad I/O complement targeted for industrial-grade designs that require high integration and environmental robustness.
As a member of the Stratix V GX family, this device is designed for use where large programmable logic resources, significant embedded RAM, and high I/O density are required. Series-level documentation for Stratix V GX devices shows support for high-speed transceiver channel rates, and the device is offered in industrial temperature grades for deployment in demanding environments.
Key Features
- Core Logic Approximately 340,000 logic elements enabling complex digital implementations and large-scale custom logic functions.
- LABs 128,300 LABs (logic array blocks) for structured routing and resource distribution across the device fabric.
- Embedded Memory Approximately 19.456 Mbits of on-chip RAM to support buffering, packet processing, and state-machine storage.
- I/O Density 600 user I/Os to support extensive external connectivity and high-pin-count peripheral interfaces.
- Transceiver Capability (Series-Level) Stratix V GX series documentation indicates support for high-speed GX channel rates (series-level details include channel speeds up to 14.1 Gbps); refer to device documentation for exact transceiver configuration on this part.
- Package & Mounting 780-BBGA (supplier designation 780-HBGA, 33×33) in a surface-mount FCBGA form factor for high-density board integration.
- Power Core supply range specified from 870 mV to 930 mV to match system power-rail design considerations.
- Operating Temperature Industrial-grade operation from –40 °C to 100 °C for deployment in temperature-challenging environments.
- Compliance RoHS compliant.
Typical Applications
- Industrial Control and Automation Industrial temperature rating and extensive I/O make this device suitable for complex control systems and factory automation requiring reliable operation across wide temperature ranges.
- High-Density Logic Systems Large logic element count and abundant embedded RAM support compute-heavy, custom digital processing and SoC-style integrations.
- High-Speed Serial Connectivity Series-level GX transceiver capability supports designs that require high-speed serial links (refer to device documentation for detailed transceiver specifications).
Unique Advantages
- High logic and memory density: The combination of ~340,000 logic elements and ~19.456 Mbits of embedded RAM supports large, integrated designs without immediate partitioning across multiple devices.
- Extensive I/O count: 600 I/Os reduce the need for external multiplexing and simplify board-level interfacing with peripherals and mezzanine modules.
- Industrial temperature capability: Rated from –40 °C to 100 °C to enable deployment in demanding operational environments.
- Compact, high‑pin package: 780-BBGA (33×33) FCBGA package provides high connection density in a surface-mount footprint for space-constrained boards.
- Power rail compatibility: Core voltage defined between 870 mV and 930 mV for predictable integration with regulated power supplies.
- RoHS compliant: Meets environmental requirements for lead-free manufacturing and regulatory compliance.
Why Choose 5SGXMA3E1H29I2N?
The 5SGXMA3E1H29I2N blends high logic capacity, substantial embedded memory, and a large I/O complement in a robust industrial-rated package. It is intended for engineers who need a highly integrated FPGA platform for complex digital systems, high-speed connectivity, and temperature-challenging applications.
Choosing this Stratix V GX device provides design headroom for scaling logic functions and memory usage while leveraging the Stratix V series documentation and tooling for development and integration. The device’s combination of density, I/O capability, and industrial operating range supports long-term deployment in demanding systems.
If you would like pricing, availability, or a formal quote for 5SGXMA3E1H29I2N, request a quote or submit an inquiry to receive detailed purchasing information and lead-time guidance.

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