5SGXMA3E1H29I2N

IC FPGA 600 I/O 780HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 780-BBGA, FCBGA

Quantity 159 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXMA3E1H29I2N – Stratix® V GX FPGA, 340,000 logic elements, 600 I/Os

The 5SGXMA3E1H29I2N is an Intel Stratix® V GX field-programmable gate array (FPGA) offered in a 780-BBGA FCBGA package. It delivers high logic capacity, large on-chip memory, and a broad I/O complement targeted for industrial-grade designs that require high integration and environmental robustness.

As a member of the Stratix V GX family, this device is designed for use where large programmable logic resources, significant embedded RAM, and high I/O density are required. Series-level documentation for Stratix V GX devices shows support for high-speed transceiver channel rates, and the device is offered in industrial temperature grades for deployment in demanding environments.

Key Features

  • Core Logic  Approximately 340,000 logic elements enabling complex digital implementations and large-scale custom logic functions.
  • LABs  128,300 LABs (logic array blocks) for structured routing and resource distribution across the device fabric.
  • Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, packet processing, and state-machine storage.
  • I/O Density  600 user I/Os to support extensive external connectivity and high-pin-count peripheral interfaces.
  • Transceiver Capability (Series-Level)  Stratix V GX series documentation indicates support for high-speed GX channel rates (series-level details include channel speeds up to 14.1 Gbps); refer to device documentation for exact transceiver configuration on this part.
  • Package & Mounting  780-BBGA (supplier designation 780-HBGA, 33×33) in a surface-mount FCBGA form factor for high-density board integration.
  • Power  Core supply range specified from 870 mV to 930 mV to match system power-rail design considerations.
  • Operating Temperature  Industrial-grade operation from –40 °C to 100 °C for deployment in temperature-challenging environments.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial Control and Automation  Industrial temperature rating and extensive I/O make this device suitable for complex control systems and factory automation requiring reliable operation across wide temperature ranges.
  • High-Density Logic Systems  Large logic element count and abundant embedded RAM support compute-heavy, custom digital processing and SoC-style integrations.
  • High-Speed Serial Connectivity  Series-level GX transceiver capability supports designs that require high-speed serial links (refer to device documentation for detailed transceiver specifications).

Unique Advantages

  • High logic and memory density: The combination of ~340,000 logic elements and ~19.456 Mbits of embedded RAM supports large, integrated designs without immediate partitioning across multiple devices.
  • Extensive I/O count: 600 I/Os reduce the need for external multiplexing and simplify board-level interfacing with peripherals and mezzanine modules.
  • Industrial temperature capability: Rated from –40 °C to 100 °C to enable deployment in demanding operational environments.
  • Compact, high‑pin package: 780-BBGA (33×33) FCBGA package provides high connection density in a surface-mount footprint for space-constrained boards.
  • Power rail compatibility: Core voltage defined between 870 mV and 930 mV for predictable integration with regulated power supplies.
  • RoHS compliant: Meets environmental requirements for lead-free manufacturing and regulatory compliance.

Why Choose 5SGXMA3E1H29I2N?

The 5SGXMA3E1H29I2N blends high logic capacity, substantial embedded memory, and a large I/O complement in a robust industrial-rated package. It is intended for engineers who need a highly integrated FPGA platform for complex digital systems, high-speed connectivity, and temperature-challenging applications.

Choosing this Stratix V GX device provides design headroom for scaling logic functions and memory usage while leveraging the Stratix V series documentation and tooling for development and integration. The device’s combination of density, I/O capability, and industrial operating range supports long-term deployment in demanding systems.

If you would like pricing, availability, or a formal quote for 5SGXMA3E1H29I2N, request a quote or submit an inquiry to receive detailed purchasing information and lead-time guidance.

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