5SGXMA3E2H29C1N

The 5SGXMA3E2H29C1N is an Intel Stratix® V GX field-programmable gate array (FPGA) in a 780-ball BGA (FCBGA) package. It delivers large programmable logic capacity, extensive embedded memory, and a high pin count to support complex, high-density digital designs.

Built for commercial-grade applications, this device combines 340,000 logic elements, approximately 19.5 Mbits of on-chip RAM, and 600 I/O pins to address demanding workloads that require significant logic, memory, and I/O integration while operating from a 0°C to 85°C temperature range and a core voltage between 870 mV and 930 mV.

Key Features

• Logic Capacity — 340,000 logic elements and 128,300 logic array blocks provide substantial programmable fabric for large-scale designs.
• Embedded Memory — Approximately 19.5 Mbits of total on-chip RAM to support large buffering, lookup tables, and state storage.
• I/O Resources — 600 I/O pins to accommodate high connector counts, multi-channel interfaces, and extensive peripheral connectivity.
• Power and Voltage — Core voltage supply specified at 870 mV to 930 mV for defined power and timing behavior.
• Package & Mounting — 780-BBGA (supplier package listed as 780-HBGA, 33×33) in an FCBGA form factor; surface-mount for PCB integration.
• Operating Grade & Temperature — Commercial grade with an operating temperature range of 0°C to 85°C.
• Standards Compliance — RoHS compliant.
• Stratix V GX Family Characteristics — As a member of the Stratix V GX family, the device is documented in the Stratix V device datasheet covering electrical and switching characteristics, I/O timing, and transceiver/periphery performance.

Typical Applications

• High‑density digital processing — Use the large logic capacity and embedded memory for complex FPGA-based compute pipelines and algorithm implementation.
• Multi‑channel I/O systems — 600 I/O pins support boards requiring many external interfaces, sensors, or multi-lane connectivity.
• Data buffering and packet processing — Significant on-chip RAM provides space for queues, FIFOs, and packet-handling logic.

Unique Advantages

• Large programmable fabric: 340,000 logic elements enable implementation of highly parallel designs and large custom accelerators.
• Substantial embedded memory: Approximately 19.5 Mbits of RAM reduces dependence on external memory for many buffering and storage needs.
• High I/O density: 600 I/O pins simplify designs that require many external connections without needing additional interface chips.
• Commercial-grade suitability: Specified for 0°C to 85°C operation to match typical commercial environmental requirements.
• Defined power envelope: Core supply range of 870 mV–930 mV allows predictable power and timing design margining.
• Surface-mount BGA packaging: 780-ball FCBGA (33×33) package supports compact, high-density PCB layouts.

Why Choose 5SGXMA3E2H29C1N?

This Stratix V GX FPGA offers a compelling combination of large logic capacity, ample embedded memory, and high I/O count in a commercial-grade FCBGA package. It is suited to designers who need to integrate complex digital functions, substantial buffering, and many external interfaces on a single programmable device while keeping to defined voltage and temperature requirements.

The device is supported by the Stratix V device documentation for electrical and switching characteristics, enabling informed system-level power and timing design. Its packaging and RoHS compliance simplify board-level integration for commercial applications that require dense, high-capacity FPGA resources.

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