5SGXMA3E2H29C2L

The 5SGXMA3E2H29C2L is an Intel Stratix V GX family FPGA provided in a 780‑BBGA (FCBGA) package. It combines high logic capacity and on‑chip memory with dense I/O to support complex, high‑integration FPGA designs.

Key device parameters include 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and 600 user I/Os. The device is offered as a commercial‑grade, surface‑mount part with a core voltage supply range of 820 mV to 880 mV and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core & Logic 340,000 logic elements provide substantial programmable logic resources for large‑scale designs.
• Logic Array Blocks 128,300 LABs (Logic Array Blocks) for structured logic partitioning and resource planning.
• Embedded Memory Approximately 19.456 Mbits of on‑chip RAM to support buffering, packet processing, and complex state machines.
• I/O Density 600 user I/Os enabling extensive peripheral interfacing and high pin‑count system designs.
• Power Supply Core voltage supply range of 820 mV to 880 mV for defined power‑domain design and power budgeting.
• Package & Mounting 780‑BBGA (FCBGA) package; supplier device package listed as 780‑HBGA (33 × 33 mm). Surface‑mount mounting type supports standard BGA assembly processes.
• Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance RoHS compliant to support environmentally regulated production requirements.
• Family Transceiver Options (Series Information) Stratix V GX devices in the family are offered with transceiver speed grades; example GX channel grades in the series include 14.1 Gbps and 12.5 Gbps (series specification).

Typical Applications

• High‑density logic systems — Suitable where large programmable logic capacity and abundant I/O are required for complex control, signal processing, or custom compute functions.
• Buffering and on‑chip data handling — The approximately 19.456 Mbits of embedded RAM supports temporary storage, packet buffering, and localized memory requirements.
• High‑pin‑count interface aggregation — 600 I/Os enable aggregation of multiple peripherals, sensors, or external interfaces on a single FPGA platform.

Unique Advantages

• High logic capacity: 340,000 logic elements deliver the resources needed for large-scale, feature‑rich FPGA implementations.
• Substantial on‑chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependency on external memory for intermediate storage and buffering.
• Extensive I/O: 600 user I/Os allow flexible connectivity and support for dense board-level integration.
• Defined low‑voltage core operation: 820 mV to 880 mV core supply range provides a clear target for power‑domain design and management.
• Commercial temperature and RoHS compliance: Commercial operating range (0 °C to 85 °C) and RoHS status support mainstream production and regulatory needs.
• Compact, high‑density package: 780‑BBGA (supplier 780‑HBGA, 33 × 33 mm) supports high I/O density in a compact BGA footprint for space‑constrained designs.

Why Choose 5SGXMA3E2H29C2L?

The 5SGXMA3E2H29C2L delivers a combination of large programmable logic resources, significant embedded memory, and high I/O count in a commercial‑grade Stratix V GX FPGA package. Its defined core voltage range and BGA package make it suitable for designers who need high integration density and deterministic power domains.

This part is appropriate for engineering teams building complex, logic‑intensive systems that require substantial on‑chip RAM and flexible interfacing. Selecting a device from the Stratix V GX family also aligns designs with the series' transceiver and performance options described in the family documentation.

Request a quote or submit an inquiry to check availability and obtain pricing and lead‑time information for the 5SGXMA3E2H29C2L.