5SGXMA3E2H29C2G

The 5SGXMA3E2H29C2G is a Stratix V GX field-programmable gate array (FPGA) IC delivering high logic density and extensive on-chip memory for complex digital designs. As a GX-class Stratix V device, it is part of a family that includes high-speed transceiver capability and comprehensive I/O resources, addressing designs that require large programmable logic arrays and substantial embedded RAM.

Engineered for commercial-temperature applications, this device combines 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and 600 I/O pins in a 780-ball BGA package to support data-processing, multi-channel I/O, and high-density integration requirements.

Key Features

• Logic Capacity 340,000 logic elements to implement large-scale digital logic and complex state machines.
• Embedded Memory Approximately 19.456 Mbits of on-chip RAM for buffering, LUT-based storage, and data-path implementations.
• I/O Resources 600 I/O pins to support wide parallel interfaces and multi-channel connectivity.
• Transceiver Capability (Series-Level) Stratix V GX devices support high-speed transceiver speed grades (series documentation lists GX channel options up to 14.1 Gbps), suitable for high-speed serial link implementations.
• Power and Core Voltage Core voltage supply range from 870 mV to 930 mV, enabling operation at the device’s specified core levels.
• Package 780-ball BGA (FCBGA / supplier 780-HBGA, 33 × 33 mm) for high-density board-level mounting and thermal/mechanical stability.
• Operating Conditions Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• RoHS Compliance Device is RoHS compliant.

Typical Applications

• High-speed serial interfaces Leverage the Stratix V GX transceiver speed-grade support and 600 I/Os for multi-lane serial links and backplane connectivity.
• High-density logic and compute Deploy the 340,000 logic elements and ~19.456 Mbits of embedded RAM for complex signal processing, packet processing, and custom compute accelerators.
• Data aggregation and buffering Use the large on-chip RAM and abundant I/Os for data buffering, interface bridging, and multi-protocol aggregation tasks.

Unique Advantages

• High logic density: 340,000 logic elements enable implementation of large, integrated designs without external programmable logic.
• Substantial embedded memory: Approximately 19.456 Mbits of on-chip RAM reduces dependence on external memory for many buffering and data-path requirements.
• Extensive I/O count: 600 I/Os provide flexibility for wide parallel buses, multiple interfaces, and channel-rich applications.
• Commercial-grade operating range: Rated for 0 °C to 85 °C to match standard commercial deployments and system environments.
• High-density BGA package: 780-ball FCBGA (33 × 33 mm) supports compact board layouts and robust electrical performance.

Why Choose 5SGXMA3E2H29C2G?

The 5SGXMA3E2H29C2G balances very high logic capacity and on-chip memory with a large I/O complement, making it well-suited for designs that require dense programmable logic, significant embedded RAM, and multi-channel connectivity. Its Stratix V GX lineage provides access to series-level transceiver capabilities and detailed device electrical and timing characteristics for rigorous system design.

This device targets engineers and system architects building high-performance communication, data-processing, or integration-heavy designs who need a commercially rated FPGA with proven series-level specifications and a high degree of functional integration.

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