5SGXMA3E2H29C1G

The 5SGXMA3E2H29C1G is an Intel Stratix V GX family FPGA in a 780-BBGA (FCBGA) package designed for high-density programmable logic implementations. This commercial-grade device provides a large logic fabric coupled with substantial on-chip memory and extensive I/O to address complex digital designs.

Key attributes include 340,000 logic elements, approximately 19.456 Mbits of embedded memory, up to 600 I/O pins, and a specified core supply voltage range of 870 mV to 930 mV. The device is RoHS compliant and rated for operation from 0 °C to 85 °C.

Key Features

• Logic Capacity  340,000 logic elements for implementing large-scale digital functions and complex algorithms.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, lookup tables, and data storage without external memory.
• I/O Density  Up to 600 I/O pins to support broad system interfacing and multiple parallel signals.
• Power and Core Supply  Core voltage specified between 870 mV and 930 mV, enabling predictable power delivery and design planning.
• Package and Mounting  Surface-mount 780-BBGA (Supplier package listed as 780-HBGA, 33 × 33 mm) for compact, high-pin-count board designs.
• Operating Range and Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant to support regulatory requirements for lead-free assemblies.

Typical Applications

• High-density digital processing  Implement large logic designs and custom datapaths that require extensive logic elements and embedded RAM.
• System prototyping and FPGA-based platforms  Use the device for prototyping complex SoC functions or as a programmable accelerator in development systems.
• Multi-channel I/O aggregation  Leverage the high I/O count to consolidate signals from multiple peripherals, sensors, or parallel interfaces.
• Memory-intensive logic functions  Deploy the on-chip Mbits of RAM for frame buffering, table storage, and intermediate data staging without immediate reliance on external memory.

Unique Advantages

• High logic density: 340,000 logic elements provide headroom for complex state machines, signal processing, and custom logic integration.
• Substantial embedded memory: Approximately 19.456 Mbits of on-chip RAM reduces external memory dependencies and simplifies BOM.
• Large I/O footprint: Up to 600 I/Os enable flexible system partitioning and direct interfacing with numerous peripherals.
• Compact, high-pin-count package: 780-BBGA (33 × 33 mm supplier package) balances integration density with board-level routing considerations.
• Clear commercial operating specification: Defined core voltage range (870–930 mV) and operating temperature (0 °C to 85 °C) aid power and thermal planning.
• RoHS compliant: Meets lead-free manufacturing requirements for commercial electronic products.

Why Choose 5SGXMA3E2H29C1G?

The 5SGXMA3E2H29C1G combines a very large logic fabric and significant embedded memory with a high I/O count in a compact 780-BBGA package, making it suitable for demanding commercial FPGA applications where integration density and on-chip resources matter. Its defined electrical and environmental specifications support predictable system design and integration on commercial products.

This device is appropriate for design teams implementing large-scale programmable logic, developers building FPGA-based prototypes, and system integrators needing substantial I/O and on-chip RAM within a single, RoHS-compliant FPGA package.

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