5SGXMA3E2H29C2N

The 5SGXMA3E2H29C2N is a Stratix V GX field-programmable gate array (FPGA) in a 780‑ball BGA (FCBGA) package. It delivers high on-chip logic capacity and extensive I/O in a surface-mount package for commercial-temperature designs.

Targeted at applications that require large programmable logic capacity and significant I/O bandwidth, this device combines approximately 340,000 logic elements, roughly 19.456 Mbits of embedded RAM, and support for Stratix V GX family high-speed transceivers as described in the device series documentation.

Key Features

• Logic Capacity — Approximately 340,000 logic elements to implement large-scale programmable logic and complex datapaths.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM for buffering, FIFOs, and local storage.
• I/O Density — 600 user I/O pins to support broad interfacing and high pin-count system designs.
• Package and Mounting — 780‑BBGA (FCBGA) package; supplier package listed as 780‑HBGA (33×33); surface-mount mounting type for board-level integration.
• Power Supply — Core voltage supply range from 870 mV to 930 mV to match system power-domain requirements.
• Operating Temperature — Commercial grade temperature range from 0 °C to 85 °C.
• Series-Level Transceiver Capability — As a Stratix V GX device, the family documentation includes high-speed transceiver support (series datasheet lists GX channel options up to 14.1 Gbps for applicable speed grades).
• Compliance — RoHS‑compliant status for environmental regulation compatibility.

Typical Applications

• High-density digital processing — Implement large custom datapaths, signal processing blocks, and parallel processing engines using the device’s high logic element count and embedded RAM.
• Communications and networking equipment — Use the Stratix V GX family’s documented high-speed transceiver capabilities together with 600 I/Os for protocol bridging, packet processing, and line-card interfaces.
• Data buffering and aggregation — Leverage the substantial on-chip RAM for buffering, packet FIFOs, and traffic shaping in systems that require local memory.

Unique Advantages

• Substantial programmable capacity — The large logic element count supports complex designs and resource-intensive functions without immediate need for external logic.
• Extensive I/O resources — 600 I/Os provide flexibility for high-pin-count peripherals, wide buses, and multi-lane interfaces.
• On-chip memory for system efficiency — Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and scratchpad needs.
• Commercial-grade thermal envelope — Rated for 0 °C to 85 °C, suitable for standard commercial deployments and typical electronics environments.
• Surface-mount BGA packaging — The 780‑ball FCBGA (33×33) footprint enables compact board layouts and high-density system designs.
• RoHS compliant — Meets common environmental directive requirements for lead‑free assembly.

Why Choose 5SGXMA3E2H29C2N?

The 5SGXMA3E2H29C2N provides a balanced combination of high logic density, substantial embedded memory, and broad I/O capability in a commercial-temperature Stratix V GX device. Its package and power requirements make it suitable for board-level integration where large programmable fabric and significant interfacing are required.

Designers seeking a Stratix V GX FPGA for compute-heavy logic, high-throughput I/O, or applications that leverage the family’s high-speed transceiver options will find this device aligns with those requirements while maintaining RoHS compliance and standard commercial operating conditions.

Request a quote or submit an inquiry for pricing and availability to start integrating the 5SGXMA3E2H29C2N into your next design.